JPS6387008U - - Google Patents
Info
- Publication number
- JPS6387008U JPS6387008U JP18097186U JP18097186U JPS6387008U JP S6387008 U JPS6387008 U JP S6387008U JP 18097186 U JP18097186 U JP 18097186U JP 18097186 U JP18097186 U JP 18097186U JP S6387008 U JPS6387008 U JP S6387008U
- Authority
- JP
- Japan
- Prior art keywords
- less
- release layer
- resin film
- main component
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Description
第１図及び第２図は本考案の代表的なポリウレ
タン系樹脂フイルム成膜用支持体の断面構成図で
ある。
１……基材、２……特定限定の超低密度ポリエ
チレンを主成分とするものから成る剥離層、３…
…接着増強層。
FIGS. 1 and 2 are cross-sectional views of a typical support for forming a polyurethane resin film of the present invention. 1...Base material, 2...Peeling layer consisting of a material whose main component is limited ultra-low density polyethylene, 3...
...adhesion enhancing layer.
Claims (1)
０００Kg／cm2以下、かつ表面ぬれ特性がＪＩＳ
Ｋ６７６８のぬれ指数で３４ｄｙｎ／cm以下、か
つ融点が１１０°Ｃ以上の密度で０．９１０ｇ／
ｃｃ以下の超低密度ポリエチレンを主成分とする
ものから成る、前記剥離層を有するポリウレタン
系樹脂フイルム成膜用支持体。 The release layer has a bending rigidity of 1 according to ASTM D747.
000Kg/cm 2 or less, and the surface wettability is JIS
Wetting index of K6768 is 34 dyn/cm or less, and density is 0.910 g/cm with a melting point of 110°C or higher.
A support for forming a polyurethane resin film, which has the above-mentioned release layer and is made of ultra-low density polyethylene of cc or less as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18097186U JPH0436251Y2 (en) | 1986-11-25 | 1986-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18097186U JPH0436251Y2 (en) | 1986-11-25 | 1986-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6387008U true JPS6387008U (en) | 1988-06-07 |
| JPH0436251Y2 JPH0436251Y2 (en) | 1992-08-27 |
Family
ID=31125417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18097186U Expired JPH0436251Y2 (en) | 1986-11-25 | 1986-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436251Y2 (en) |
-
1986
- 1986-11-25 JP JP18097186U patent/JPH0436251Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436251Y2 (en) | 1992-08-27 |
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