JPS6395238U - - Google Patents

Info

Publication number
JPS6395238U
JPS6395238U JP1986190612U JP19061286U JPS6395238U JP S6395238 U JPS6395238 U JP S6395238U JP 1986190612 U JP1986190612 U JP 1986190612U JP 19061286 U JP19061286 U JP 19061286U JP S6395238 U JPS6395238 U JP S6395238U
Authority
JP
Japan
Prior art keywords
adhesive
ultrasonic bonding
rib
groove
fix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986190612U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986190612U priority Critical patent/JPS6395238U/ja
Publication of JPS6395238U publication Critical patent/JPS6395238U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本案の一実施例を示す図、第2図はA
―A部の説明図である。 1……モールドケース、2……金属製端子、3
……フイン、4……硬度の高い接着剤、5……リ
ブ、6……溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 超音波ボンデイングにおいて、モールドケース
    内に埋込まれた金属製端子の底部にリブを設けフ
    イン側に溝を設けることにより位置固定、接着剤
    塗布位置決めするとともに硬度の高い接着剤を用
    いることにより超音波吸収を防止することを特徴
    とする超音波ボンデイング用端子接着構造。
JP1986190612U 1986-12-12 1986-12-12 Pending JPS6395238U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986190612U JPS6395238U (ja) 1986-12-12 1986-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986190612U JPS6395238U (ja) 1986-12-12 1986-12-12

Publications (1)

Publication Number Publication Date
JPS6395238U true JPS6395238U (ja) 1988-06-20

Family

ID=31143994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986190612U Pending JPS6395238U (ja) 1986-12-12 1986-12-12

Country Status (1)

Country Link
JP (1) JPS6395238U (ja)

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