JPS6395253U - - Google Patents

Info

Publication number
JPS6395253U
JPS6395253U JP1986190938U JP19093886U JPS6395253U JP S6395253 U JPS6395253 U JP S6395253U JP 1986190938 U JP1986190938 U JP 1986190938U JP 19093886 U JP19093886 U JP 19093886U JP S6395253 U JPS6395253 U JP S6395253U
Authority
JP
Japan
Prior art keywords
image sensor
wiring
reading
thin film
sensor according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986190938U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986190938U priority Critical patent/JPS6395253U/ja
Publication of JPS6395253U publication Critical patent/JPS6395253U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Wire Bonding (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)

Description

【図面の簡単な説明】
第１図、第２図、第３図は各々実施例―１、実
施例―２、実施例―３で作製した本考案に基づく
イメージセンサの概略を示す平面図であり、第４
図は従来のイメージセンサの概略を示す平面図で
あり、第５図は従来のイメージセンサの１受光素
子につらなる回路の等価回路図である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 直線状に配置された多数の受光素子の出力
    用配線群を各々読み取り用ＩＣの入力端子にワイ
    ヤーボンデイングさせたイメージセンサにおいて
    、該読み取り用ＩＣとして直線状に配置された多
    数の入力端子を有する読み取り用ＩＣを用いるこ
    とを特徴とするイメージセンサ。 (2) 該出力用配線群の各々の配線の浮遊電気容
    量が等しい実用新案登録請求の範囲第１項記載の
    イメージセンサ。 (3) 該出力用配線群が平行な下部薄膜配線およ
    び平行な上部薄膜配線からなる立体薄膜配線であ
    る実用新案登録請求の範囲第１項又は第２項記載
    のイメージセンサ。 (4) 該多数の入力端子群は該多数の受光素子群
    とほぼ等しい長さを有し、該読み取り用ＩＣが受
    光素子群と平行に設置されている実用新案登録請
    求の範囲第１項又は第２項記載のイメージセンサ
    。
JP1986190938U 1986-12-11 1986-12-11 Pending JPS6395253U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986190938U JPS6395253U (ja) 1986-12-11 1986-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986190938U JPS6395253U (ja) 1986-12-11 1986-12-11

Publications (1)

Publication Number Publication Date
JPS6395253U true JPS6395253U (ja) 1988-06-20

Family

ID=31144618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986190938U Pending JPS6395253U (ja) 1986-12-11 1986-12-11

Country Status (1)

Country Link
JP (1) JPS6395253U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963869A (ja) * 1982-10-04 1984-04-11 Fuji Xerox Co Ltd 原稿読取装置
JPS60171767A (ja) * 1984-02-17 1985-09-05 Matsushita Electric Ind Co Ltd 光電変換装置
JPS61184869A (ja) * 1985-02-12 1986-08-18 Mitsubishi Electric Corp イメ−ジセンサ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963869A (ja) * 1982-10-04 1984-04-11 Fuji Xerox Co Ltd 原稿読取装置
JPS60171767A (ja) * 1984-02-17 1985-09-05 Matsushita Electric Ind Co Ltd 光電変換装置
JPS61184869A (ja) * 1985-02-12 1986-08-18 Mitsubishi Electric Corp イメ−ジセンサ

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