JPS6399558U - - Google Patents

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Publication number
JPS6399558U
JPS6399558U JP19665286U JP19665286U JPS6399558U JP S6399558 U JPS6399558 U JP S6399558U JP 19665286 U JP19665286 U JP 19665286U JP 19665286 U JP19665286 U JP 19665286U JP S6399558 U JPS6399558 U JP S6399558U
Authority
JP
Japan
Prior art keywords
seat
legs
seat sheet
chair
upper frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19665286U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19665286U priority Critical patent/JPS6399558U/ja
Publication of JPS6399558U publication Critical patent/JPS6399558U/ja
Pending legal-status Critical Current

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  • Special Chairs (AREA)

Description

【図面の簡単な説明】
第1図第3図は本考案に係る正座用安楽椅子の
各例の斜視図、第2図は第1図の椅子の使用態様
における縦断側面図である。 1,1a……正座用安楽椅子、2,2a……椅
子枠体、3,3a……座席シート、4,4a……
上部枠桟、5a,5b,5c……3辺桟部、6,
6a……脚柱、7……接地桟、9……座部シート
部分、10a,10b,10c,16a,16b
,16c……周側シート部、13……臀部、14
……下腿。

Claims (1)

    【実用新案登録請求の範囲】
  1. 椅子枠体と座席シートとからなり、椅子枠体は
    上から見て「コ」字形を呈する上部枠桟の並行す
    る左右の桟部の前端から脚柱を垂下し脚柱の下端
    から後方に向く接地桟を連成したものとし、座席
    シートは座部シート部分の3辺縁に、前記上部枠
    桟に上縁を掛止め垂下する周側シート部をそなえ
    、且つ座部シート部分と脚柱下端間の間隔は座部
    シート部分の下方に下腿を挿入可能の寸法とした
    ことを特徴とする正座用安楽椅子。
JP19665286U 1986-12-18 1986-12-18 Pending JPS6399558U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19665286U JPS6399558U (ja) 1986-12-18 1986-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19665286U JPS6399558U (ja) 1986-12-18 1986-12-18

Publications (1)

Publication Number Publication Date
JPS6399558U true JPS6399558U (ja) 1988-06-28

Family

ID=31155668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19665286U Pending JPS6399558U (ja) 1986-12-18 1986-12-18

Country Status (1)

Country Link
JP (1) JPS6399558U (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
WO2015004765A1 (ja) * 2013-07-11 2015-01-15 Hashiba Yoshimichi 椅子
JP2022180327A (ja) * 2021-05-24 2022-12-06 チャン アレクサンダー 折畳椅子

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5242705B2 (ja) * 1975-02-25 1977-10-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5242705B2 (ja) * 1975-02-25 1977-10-26

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7579694B2 (en) 2003-02-18 2009-08-25 Unitive International Limited Electronic devices including offset conductive bumps
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
WO2015004765A1 (ja) * 2013-07-11 2015-01-15 Hashiba Yoshimichi 椅子
JP2022180327A (ja) * 2021-05-24 2022-12-06 チャン アレクサンダー 折畳椅子

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