JPS6410073A - Decompression device - Google Patents
Decompression deviceInfo
- Publication number
- JPS6410073A JPS6410073A JP62164715A JP16471587A JPS6410073A JP S6410073 A JPS6410073 A JP S6410073A JP 62164715 A JP62164715 A JP 62164715A JP 16471587 A JP16471587 A JP 16471587A JP S6410073 A JPS6410073 A JP S6410073A
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- valve disc
- chamber
- increases
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000006837 decompression Effects 0.000 title 1
- 239000003507 refrigerant Substances 0.000 abstract 8
- 238000004378 air conditioning Methods 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
- F25B41/38—Expansion means; Dispositions thereof specially adapted for reversible cycles, e.g. bidirectional expansion restrictors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Fluid Pressure (AREA)
Abstract
PURPOSE: To enhance operational efficiency by constituting a pressure reducing unit of a refrigerant pipe and a valve disc and providing a control member for varying the sliding distance of the valve disc depending on the pressure of refrigerant flowing into the pipe. CONSTITUTION: A pressure reducing unit 9 comprises a valve disc 13 supported by a pipe 10. At the time of cooling operation, refrigerant delivered from a compressor 6 flows from an outdoor heat exchanger 8 through a refrigerant tube 11 into the second chamber 20 of the pressure reducing unit 9. The heavier the air conditioning load, the higher the r.p.m. of the motor of the compressor 6 and the current velocity of refrigerant flowing into the second chamber 20 increases. Consequently, the pressure of refrigerant increases to shift the valve disc 13 to the right while resisting against the resiliency of a first spring 17. The valve disc 13 is thereby shifted from the left end of sliding face 14 to shorten the length of a refrigerant passage 21 defined by a spiral groove 15 and the valve disc 13 thus decreasing the resistance. Refrigerant flows from the second chamber 20 to a first chamber 19 through the passage 21 having decreased resistance. When the air conditioning load increases, the length of the passage 21 increases thus increasing the resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62164715A JPS6410073A (en) | 1987-07-01 | 1987-07-01 | Decompression device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62164715A JPS6410073A (en) | 1987-07-01 | 1987-07-01 | Decompression device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6410073A true JPS6410073A (en) | 1989-01-13 |
Family
ID=15798511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62164715A Pending JPS6410073A (en) | 1987-07-01 | 1987-07-01 | Decompression device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6410073A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4766579B2 (en) * | 1998-11-30 | 2011-09-07 | アプライド マテリアルズ インコーポレイテッド | Electrochemical deposition equipment |
| US8075756B2 (en) | 1999-05-18 | 2011-12-13 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
-
1987
- 1987-07-01 JP JP62164715A patent/JPS6410073A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4766579B2 (en) * | 1998-11-30 | 2011-09-07 | アプライド マテリアルズ インコーポレイテッド | Electrochemical deposition equipment |
| US8075756B2 (en) | 1999-05-18 | 2011-12-13 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
| US8961755B2 (en) | 1999-05-18 | 2015-02-24 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
| US9714476B2 (en) | 1999-05-18 | 2017-07-25 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
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