JPS6410653A - Manufacture of lead frame for semiconductor device - Google Patents

Manufacture of lead frame for semiconductor device

Info

Publication number
JPS6410653A
JPS6410653A JP62166311A JP16631187A JPS6410653A JP S6410653 A JPS6410653 A JP S6410653A JP 62166311 A JP62166311 A JP 62166311A JP 16631187 A JP16631187 A JP 16631187A JP S6410653 A JPS6410653 A JP S6410653A
Authority
JP
Japan
Prior art keywords
lead frame
insulator
frame part
island
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62166311A
Other languages
Japanese (ja)
Inventor
Satoshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62166311A priority Critical patent/JPS6410653A/en
Publication of JPS6410653A publication Critical patent/JPS6410653A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the generation of bending and the like at the tip of a lead before assembling process, by containing a process wherein the vicinity of a lead frame part near an island is previously fixed by an insulator, and a process wherein lead tip parts near a punch island are released in the state where the lead frame part is fixed by the above mentioned insulator. CONSTITUTION:An insulator 4 is previously fixed before a lead frame part 2 near an island 3 is punched. The lead frame part 2 is punched in the state of being fixed by the insulator 4. In the lead frame part constituted in this manner, even after lead tip parts 5 near an island 3 are completely released, the vicinity of the tip parts are fixed by the insulator 4, so that bending and the like at the tip parts 5 of the leads 1 do not generate before assembling process.
JP62166311A 1987-07-02 1987-07-02 Manufacture of lead frame for semiconductor device Pending JPS6410653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62166311A JPS6410653A (en) 1987-07-02 1987-07-02 Manufacture of lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166311A JPS6410653A (en) 1987-07-02 1987-07-02 Manufacture of lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6410653A true JPS6410653A (en) 1989-01-13

Family

ID=15828993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166311A Pending JPS6410653A (en) 1987-07-02 1987-07-02 Manufacture of lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6410653A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136248A (en) * 1983-12-24 1985-07-19 Toshiba Corp Manufacture of lead frame
JPS61125161A (en) * 1984-11-22 1986-06-12 Mitsui Haitetsuku:Kk Manufacture of lead frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136248A (en) * 1983-12-24 1985-07-19 Toshiba Corp Manufacture of lead frame
JPS61125161A (en) * 1984-11-22 1986-06-12 Mitsui Haitetsuku:Kk Manufacture of lead frame

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