JPS6411094A - Flux for soldering - Google Patents
Flux for solderingInfo
- Publication number
- JPS6411094A JPS6411094A JP16644487A JP16644487A JPS6411094A JP S6411094 A JPS6411094 A JP S6411094A JP 16644487 A JP16644487 A JP 16644487A JP 16644487 A JP16644487 A JP 16644487A JP S6411094 A JPS6411094 A JP S6411094A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- soldering
- gallate
- expressed
- ester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 title abstract 6
- 238000005476 soldering Methods 0.000 title abstract 4
- 150000002148 esters Chemical class 0.000 abstract 3
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000000344 soap Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE:To prevent the formation of copper soap and to obtain a high- reliability flux by incorporating the gallate expressed by the formula as one component of the soldering flux into said flux. CONSTITUTION:The gallate expressed by the formula is incorporated into the soldering flux. The alkyl group of the ester is expressed by -CnH2n+1 and the esters of n=1, 2, 3, 5, 8, 12, 14, 16, 18 are commercially marketed, all of which are usable for this purpose. Since the gallate is not dissociated by water, said ester does not release ionic materials. The formation of the copper soap is thereby prevented and the high reliability flux used for soldering of electronic parts is obtd.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16644487A JPS6411094A (en) | 1987-07-02 | 1987-07-02 | Flux for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16644487A JPS6411094A (en) | 1987-07-02 | 1987-07-02 | Flux for soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411094A true JPS6411094A (en) | 1989-01-13 |
| JPH0433557B2 JPH0433557B2 (en) | 1992-06-03 |
Family
ID=15831519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16644487A Granted JPS6411094A (en) | 1987-07-02 | 1987-07-02 | Flux for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6411094A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0929486A (en) * | 1995-07-24 | 1997-02-04 | Matsushita Electric Ind Co Ltd | Cream solder |
| WO2006025224A1 (en) | 2004-08-31 | 2006-03-09 | Senju Metal Industry Co., Ltd | Flux for soldering |
-
1987
- 1987-07-02 JP JP16644487A patent/JPS6411094A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0929486A (en) * | 1995-07-24 | 1997-02-04 | Matsushita Electric Ind Co Ltd | Cream solder |
| WO2006025224A1 (en) | 2004-08-31 | 2006-03-09 | Senju Metal Industry Co., Ltd | Flux for soldering |
| US8404057B2 (en) | 2004-08-31 | 2013-03-26 | Senju Metal Industry Co., Ltd. | Soldering flux |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0433557B2 (en) | 1992-06-03 |
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