JPS6411355A - Resin sealed semiconductor device - Google Patents
Resin sealed semiconductor deviceInfo
- Publication number
- JPS6411355A JPS6411355A JP16679987A JP16679987A JPS6411355A JP S6411355 A JPS6411355 A JP S6411355A JP 16679987 A JP16679987 A JP 16679987A JP 16679987 A JP16679987 A JP 16679987A JP S6411355 A JPS6411355 A JP S6411355A
- Authority
- JP
- Japan
- Prior art keywords
- grain
- molding material
- grain diameter
- resistance
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 2
- 239000011347 resin Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000012778 molding material Substances 0.000 abstract 4
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 239000004642 Polyimide Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000010136 thermoset moulding Methods 0.000 abstract 1
- 239000004634 thermosetting polymer Substances 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE:To enhance the resistance to a crack, the resistance to heat of a solder and the reliability of moistureproofness by a method wherein this device is sealed by using a thermoset molding material where a large quantity of spherical molten silica whose grain diameter, grain-size distribution and specific surface area are specified is mixed. CONSTITUTION:A spherical filler which is used as a molding material for sealing a semiconductor is prepared by mixing an epoxy resin or a polyimide or polyaminobismaleimide thermoset resin with more than 80wt.% of spherical molten silica having the following characteristics: its average grain diameter is within a range of 5-15mum; its maximum grain diameter is less than 100mum; if its grain-size distribution is expressed by using an RRS grain-size diagram., at least more than 60wt.% of an intermediate grain diameter excluding a coarse grain part and a fine grain part displays the linearity and its gradient n is less than 1.0; its average specific surface area is less than 4m<2>/g. The fluidity, the hardening performance and the molding workability of this molding material are excellent; a resin seal semiconductor manufactured by using this molding material displays the good reliability regarding the resistance to a thermal shock, the moistureproofness or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62166799A JP2633856B2 (en) | 1987-07-06 | 1987-07-06 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62166799A JP2633856B2 (en) | 1987-07-06 | 1987-07-06 | Resin-sealed semiconductor device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26403296A Division JP2760348B2 (en) | 1996-10-04 | 1996-10-04 | Thermosetting resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411355A true JPS6411355A (en) | 1989-01-13 |
| JP2633856B2 JP2633856B2 (en) | 1997-07-23 |
Family
ID=15837896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62166799A Expired - Fee Related JP2633856B2 (en) | 1987-07-06 | 1987-07-06 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2633856B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5397401A (en) * | 1992-06-29 | 1995-03-14 | Canon Kabushiki Kaisha | Semiconductor apparatus covered with a sealing resin composition |
| JPH0774290A (en) * | 1993-09-03 | 1995-03-17 | Rohm Co Ltd | Materials for packaging electronic components |
| JP2001151866A (en) * | 1999-11-30 | 2001-06-05 | Hitachi Chem Co Ltd | Epoxy resin molding compound for sealing use and electronic part device |
| JP2002275353A (en) * | 2001-03-21 | 2002-09-25 | Toray Ind Inc | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113642A (en) * | 1984-11-09 | 1986-05-31 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing use |
| JPS6296569A (en) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | Semiconductor sealing resin composition |
-
1987
- 1987-07-06 JP JP62166799A patent/JP2633856B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113642A (en) * | 1984-11-09 | 1986-05-31 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing use |
| JPS6296569A (en) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | Semiconductor sealing resin composition |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5397401A (en) * | 1992-06-29 | 1995-03-14 | Canon Kabushiki Kaisha | Semiconductor apparatus covered with a sealing resin composition |
| JPH0774290A (en) * | 1993-09-03 | 1995-03-17 | Rohm Co Ltd | Materials for packaging electronic components |
| US5698904A (en) * | 1993-09-03 | 1997-12-16 | Rohm Co., Ltd. | Packaging material for electronic components |
| JP2001151866A (en) * | 1999-11-30 | 2001-06-05 | Hitachi Chem Co Ltd | Epoxy resin molding compound for sealing use and electronic part device |
| JP2002275353A (en) * | 2001-03-21 | 2002-09-25 | Toray Ind Inc | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2633856B2 (en) | 1997-07-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |