JPS6412101B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a heat sink for IC modules that can efficiently radiate heat generated from a large number of IC modules and is suitable for high-density packaging of ICs. .

[Technical background of the invention and its problems]

Recently, electronic devices have been miniaturized by making full use of LSI integration technology and high-density packaging technology. A particular problem in achieving high-density IC mounting is the heat dissipation method of the IC module. conventionally,
For example, an aluminum fin or the like was provided on the board as a heat sink, and this used to release the heat generated from the IC module to the atmosphere.

However, there is a natural limit to the heat dissipation capacity of such a method.For example, in devices such as so-called supercomputers that require even higher density packaging of ICs, such conventional technology can no longer reach the heat dissipation capacity. It is expected that the limit will be reached. For this reason, there has been a desire for a heat sink with excellent heat dissipation characteristics that can accommodate high-density packaging.

[Purpose of the invention]

The present invention has been made in consideration of such circumstances, and its purpose is to be able to effectively dissipate heat from an IC module, and to
An object of the present invention is to provide a heatsink for an IC module that allows high-density packaging of IC modules and contributes to miniaturization of electronic devices.

[Summary of the invention]

The heat sink according to the present invention includes a sealed container whose outer surface is formed into a polygonal shape so that a plurality of flat surfaces for attaching an IC module are formed in the circumferential direction, and an upper wall of the sealed container that has a plurality of flat surfaces formed in the circumferential direction. The refrigerant is composed of a plurality of hollow fins that protrude toward each other and have spaces formed inside the fins communicating with the airtight container, and a liquid refrigerant sealed in the airtight container.

〔Effect of the invention〕

According to the present invention, the liquid refrigerant sealed in the sealed container can be thermally connected to the IC module via the wall surface of the sealed container. Therefore, the heat generated from the IC module is absorbed as heat of vaporization of the refrigerant, and the vaporized refrigerant is condensed again as the pressure within the closed container increases. In this case, since a plurality of hollow fins are provided upwardly protruding from the upper wall of the sealed container so that the inner space communicates with the inside of the sealed container, the vaporized refrigerant gas enters the inner space of the hollow fins. It rises within this inner space. Then, it comes into contact with the inner surface of the hollow fin and liquefies. The liquefied refrigerant flows downward along the inner surface of the hollow fins and into the closed container. In such a circulation path, the refrigerant gas attempting to rise in the inner space of the hollow fin is not prevented from rising by the refrigerant liquid that condenses and falls. Therefore, circulation of the refrigerant is promoted and good heat radiation is achieved. In addition, in this case, unlike the conventional aluminum fins that dissipate heat to the atmosphere, heat transfer in the thickness direction of the container allows
Since heat is dissipated from the IC module, thermal resistance is significantly reduced and heat dissipation is extremely effective.

Moreover, in the present invention, the side surface of the airtight container is composed of a plurality of planes, and the IC module is attached to this side surface, so that the outer surface of the container can be used effectively, and the packaging density of the IC module can be greatly increased. can be increased to As a result, it can greatly contribute to downsizing of electronic devices.

[Embodiments of the invention]

Hereinafter, details of the present invention will be explained based on illustrated embodiments.

1 and 2, reference numeral 1 denotes a heat dissipation container whose interior is sealed, and is made of a material with good thermal conductivity such as aluminum, for example. This heat dissipation container 1 has a polyhedron whose side surface 2 is composed of six planes, and a pleat-like shape on the upper wall, that is, a hollow fin 3 that allows the internal space to communicate with the inside of the closed container. There is. A liquid refrigerant 4 such as Freon is sealed inside the heat radiation container 1 .

Six IC modules 5 are adhered to each of the six sides of the airtight container 1 .
Specifically, the IC module 5 is configured by mounting a plurality of IC chips 7 on a substrate 6 having good thermal conductivity. A connection terminal 8 is provided for electrical connection.

In the IC module heatsink according to the present embodiment configured as described above, the IC chip 7 is thermally connected to the liquid refrigerant 4 via the substrate 6 and the side surface 2 of the heat radiation container 1 . Therefore, the heat generated from the IC chip 7 is transferred to the substrate 6 and the heat dissipation container 1.
is absorbed by the liquid refrigerant 4 through the side surface 2 of the liquid refrigerant 4 as vaporization heat. The vaporized refrigerant vapor 9 moves to the lower temperature upper part of the inner space of the fin 3. Then, at this upper part, the refrigerant vapor 9 is condensed again due to the pressure increase in the upper space due to the vaporization, falls by gravity, and accumulates in the container 1. By repeating this process, the IC module 5 is always placed in the heat dissipation container 1 .
A predetermined amount of liquid refrigerant 4 necessary to cool the liquid refrigerant 4 is filled.

In this way, according to this embodiment, the IC chip 7 is connected to the IC chip 7 via the substrate 6 and the side surface 2 of the heat dissipation container 1
Since it is thermally connected to the liquid refrigerant 4, it is possible to effectively cool the IC chip 7 with low thermal resistance. Moreover, in this case, since a plurality of hollow fins 3 are provided upwardly protruding from the upper wall of the closed container 1 in such a manner that the inner space communicates with the inside of the closed container 1 , the vaporized refrigerant gas flows through the hollow fins. It enters the inner space of No. 3 and rises within this inner space. Then, it comes into contact with the inner surface of the hollow fin 3 and liquefies. The liquefied refrigerant flows down along the inner surface of the hollow fins 3 and into the closed container 1 . In this circulation path, the refrigerant gas attempting to rise in the inner space of the hollow fin 3 is not hindered in its upward movement by the refrigerant liquid that condenses and falls.
Therefore, circulation of the refrigerant is promoted and good heat radiation is achieved. In addition, the side surface 2 of the airtight container 1 is composed of a plurality of planes, and the IC is placed on these planes.
Since the structure is such that the modules 5 can be attached, the outer surface of the heat dissipation container 1 can be effectively used, and the IC modules 5 can be mounted in high density.

Note that the present invention is not limited in any way to the number of planes constituting the side surface of the heat dissipation container or the type of liquid refrigerant. In short, the present invention can be implemented with various modifications without departing from the gist thereof.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the appearance of a heat sink for an IC module according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view thereof. 1 ... Heat radiation container, 2... Side surface, 3... Fin, 4... Liquid refrigerant, 5 ... IC module, 6... Board, 7... IC
Chip, 8... Connection terminal, 9... Refrigerant vapor.

Claims (1)

[Claims] 1. An airtight container whose outer surface is formed into a polygonal shape so that a plurality of flat surfaces are formed in the circumferential direction for attaching IC modules, and a plurality of flat surfaces protrude upward from the upper wall of this airtight container. and a hollow fin having a space formed inside each of the hollow fins communicated with the airtight container, and a liquid refrigerant sealed in the airtight container.
Heatsink for IC module.