JPS6412560A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6412560A
JPS6412560A JP62170034A JP17003487A JPS6412560A JP S6412560 A JPS6412560 A JP S6412560A JP 62170034 A JP62170034 A JP 62170034A JP 17003487 A JP17003487 A JP 17003487A JP S6412560 A JPS6412560 A JP S6412560A
Authority
JP
Japan
Prior art keywords
lead frame
resin
sealing
insulating component
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62170034A
Other languages
Japanese (ja)
Inventor
Kaname Kanazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62170034A priority Critical patent/JPS6412560A/en
Publication of JPS6412560A publication Critical patent/JPS6412560A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To perform sealing with resin so as to mount a semiconductor element on the same lead frame independent of the size of the semiconductor element by a method wherein a semiconductor element is fixed to a platelike insulating component of a lead frame where tips of many inner leads of a resin sealing type semiconductor device are fixed by the plate-like insulating component. CONSTITUTION:A plate-like insulating component 2 is provided on a position of a semiconductor device lead frame 1 where an island is to be provided and an inner lead 3 tip of the lead frame 1, which is wrapped with a sealing resin 8 after resin sealing is performed, is fixed by the insulating component 2 through a brazing material, electrodes of the element 5 are connected with the inner lead 3 with bonding wires 7 through bonding. Moreover, sealing is performed with resin in such a manner as an external lead 4 of the lead frame 1 is made to extend outside the sealing resin 8, so that the element 5 can be flexibly mounted on the same lead frame.
JP62170034A 1987-07-07 1987-07-07 Semiconductor device Pending JPS6412560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62170034A JPS6412560A (en) 1987-07-07 1987-07-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62170034A JPS6412560A (en) 1987-07-07 1987-07-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6412560A true JPS6412560A (en) 1989-01-17

Family

ID=15897382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62170034A Pending JPS6412560A (en) 1987-07-07 1987-07-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6412560A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575009A (en) * 1991-09-18 1993-03-26 Oki Electric Ind Co Ltd Lead frame, semiconductor device using same and manufacture thereof
JP2005093616A (en) * 2003-09-16 2005-04-07 Renesas Technology Corp Semiconductor device and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61150246A (en) * 1984-12-24 1986-07-08 Fujitsu Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61150246A (en) * 1984-12-24 1986-07-08 Fujitsu Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575009A (en) * 1991-09-18 1993-03-26 Oki Electric Ind Co Ltd Lead frame, semiconductor device using same and manufacture thereof
JP2005093616A (en) * 2003-09-16 2005-04-07 Renesas Technology Corp Semiconductor device and manufacturing method thereof

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