JPS641258A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS641258A
JPS641258A JP62156961A JP15696187A JPS641258A JP S641258 A JPS641258 A JP S641258A JP 62156961 A JP62156961 A JP 62156961A JP 15696187 A JP15696187 A JP 15696187A JP S641258 A JPS641258 A JP S641258A
Authority
JP
Japan
Prior art keywords
bump
bonding
ball bonding
wire
shorten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62156961A
Other languages
Japanese (ja)
Other versions
JPH011258A (en
Inventor
Shin Tada
Tadaharu Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP62156961A priority Critical patent/JPS641258A/en
Publication of JPH011258A publication Critical patent/JPH011258A/en
Publication of JPS641258A publication Critical patent/JPS641258A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To shorten steps required to form a bump by containing the step of forming a ball bonding on a surface electrode by a wire bonding method to form the bump.
CONSTITUTION: The surface of a semiconductor substrate 1 is protected by an insulator protective film 2, and aluminum electrodes 3 are partly exposed as a connection to an exterior. Then, a ball bonding 6a is formed through a capillary tool 7 on the electrode 3 by a wire bonding method, and then formed as a bump layer 6. Accordingly, the bump is formed merely by wire cutting with the capillary tool immediately after the bonding. Thus, a device necessary to form the bump is only the ball bonding device to largely shorten the steps, thereby reducing its cost.
COPYRIGHT: (C)1989,JPO&Japio
JP62156961A 1987-06-23 1987-06-23 Manufacture of semiconductor device Pending JPS641258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62156961A JPS641258A (en) 1987-06-23 1987-06-23 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62156961A JPS641258A (en) 1987-06-23 1987-06-23 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPH011258A JPH011258A (en) 1989-01-05
JPS641258A true JPS641258A (en) 1989-01-05

Family

ID=15639100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62156961A Pending JPS641258A (en) 1987-06-23 1987-06-23 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS641258A (en)

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