JPS641291A - Flexible circuit board and manufacture thereof - Google Patents

Flexible circuit board and manufacture thereof

Info

Publication number
JPS641291A
JPS641291A JP15527487A JP15527487A JPS641291A JP S641291 A JPS641291 A JP S641291A JP 15527487 A JP15527487 A JP 15527487A JP 15527487 A JP15527487 A JP 15527487A JP S641291 A JPS641291 A JP S641291A
Authority
JP
Japan
Prior art keywords
unit
copper plating
ridge
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15527487A
Other languages
Japanese (ja)
Other versions
JPH07120852B2 (en
JPH011291A (en
Inventor
Toshiyuki Takeshima
Shinichi Kiyota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP62155274A priority Critical patent/JPH07120852B2/en
Publication of JPS641291A publication Critical patent/JPS641291A/en
Publication of JPH011291A publication Critical patent/JPH011291A/en
Publication of JPH07120852B2 publication Critical patent/JPH07120852B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To obtain bending flexibility at a bendable flexible unit and to prevent a step from generating at a boundary between a ridge and the flexible unit by mounting a shielding plate on a copper foil of the unit in case of plating a through hole, and conducting an electroless copper plating and electrolytic copper plating.
CONSTITUTION: When a circuit pattern is formed only on one side face of a bendable flexible unit, a through hole 8 is opened by drilling at a predetermined position at a ridge B of a component mount of a copper-extended laminated substrate 11 covered with rolled copper foils 12, 12 on both side face of a base film 1. Then, a shielding plate 14 is mounted on the substrate 11. Thereafter, when an electroless copper plating 9 and an electrolytic copper plating 10 are continuously conducted and the plate 14 are removed, a board as shown is obtained, and a process, such as an etching is performed by a normal method. Thus, thin copper plating of 1∼2μm is executed on the unit, and since a transfer section of the ridge to the unit is placed in a slope state, no step is formed at a boundary.
COPYRIGHT: (C)1989,JPO&Japio
JP62155274A 1987-06-24 1987-06-24 Flexible circuit board manufacturing method Expired - Fee Related JPH07120852B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62155274A JPH07120852B2 (en) 1987-06-24 1987-06-24 Flexible circuit board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62155274A JPH07120852B2 (en) 1987-06-24 1987-06-24 Flexible circuit board manufacturing method

Publications (3)

Publication Number Publication Date
JPS641291A true JPS641291A (en) 1989-01-05
JPH011291A JPH011291A (en) 1989-01-05
JPH07120852B2 JPH07120852B2 (en) 1995-12-20

Family

ID=15602318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62155274A Expired - Fee Related JPH07120852B2 (en) 1987-06-24 1987-06-24 Flexible circuit board manufacturing method

Country Status (1)

Country Link
JP (1) JPH07120852B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03185785A (en) * 1989-12-14 1991-08-13 Nec Corp Flexible wiring board
EP1594352A1 (en) * 2004-05-07 2005-11-09 Nitto Denko Corporation Method for manufacturing double-sided printed circuit board
JP2007194459A (en) * 2006-01-20 2007-08-02 Sumitomo Electric Ind Ltd Flexible circuit board
JP2009290198A (en) * 2008-05-30 2009-12-10 Lg Electronics Inc Soft film and display device
JP2022104088A (en) * 2020-12-28 2022-07-08 上村工業株式会社 Method of manufacturing flexible substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086358A (en) * 2004-09-16 2006-03-30 Sumitomo Electric Printed Circuit Inc Manufacturing method of double-sided printed wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112094A (en) * 1984-06-27 1986-01-20 日本メクトロン株式会社 Flexible circuit board and method of producing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112094A (en) * 1984-06-27 1986-01-20 日本メクトロン株式会社 Flexible circuit board and method of producing same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03185785A (en) * 1989-12-14 1991-08-13 Nec Corp Flexible wiring board
EP1594352A1 (en) * 2004-05-07 2005-11-09 Nitto Denko Corporation Method for manufacturing double-sided printed circuit board
US7281327B2 (en) 2004-05-07 2007-10-16 Nitto Denko Corporation Method for manufacturing double-sided printed circuit board
JP2007194459A (en) * 2006-01-20 2007-08-02 Sumitomo Electric Ind Ltd Flexible circuit board
JP2009290198A (en) * 2008-05-30 2009-12-10 Lg Electronics Inc Soft film and display device
JP2022104088A (en) * 2020-12-28 2022-07-08 上村工業株式会社 Method of manufacturing flexible substrate

Also Published As

Publication number Publication date
JPH07120852B2 (en) 1995-12-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees