JPS6413145U - - Google Patents

Info

Publication number: JPS6413145U
Authority: JP; Japan
Prior art keywords: notch; chip; heat sink; board; laminated
Prior art date: 1987-07-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP10543087U

Other languages

English (en)

Japanese (ja)

Other versions

JPH0735432Y2 (ja

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-07-09

Filing date

1987-07-09

Publication date

1989-01-24

1987-07-09 Application filed filed Critical

1987-07-09 Priority to JP10543087U priority Critical patent/JPH0735432Y2/ja

1989-01-24 Publication of JPS6413145U publication Critical patent/JPS6413145U/ja

1995-08-09 Application granted granted Critical

1995-08-09 Publication of JPH0735432Y2 publication Critical patent/JPH0735432Y2/ja

2002-07-09 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

Testing Or Measuring Of Semiconductors Or The Like (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Wire Bonding (AREA)

JP10543087U 1987-07-09 1987-07-09 集積回路素子の保持構造 Expired - Lifetime JPH0735432Y2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP10543087U JPH0735432Y2 (ja)	1987-07-09	1987-07-09	集積回路素子の保持構造

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP10543087U JPH0735432Y2 (ja)	1987-07-09	1987-07-09	集積回路素子の保持構造

Publications (2)

Publication Number	Publication Date
JPS6413145U true JPS6413145U (fr)	1989-01-24
JPH0735432Y2 JPH0735432Y2 (ja)	1995-08-09

Family

ID=31338036

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP10543087U Expired - Lifetime JPH0735432Y2 (ja)	1987-07-09	1987-07-09	集積回路素子の保持構造

Country Status (1)

Country	Link
JP (1)	JPH0735432Y2 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS56172970U (fr) *	1980-05-20	1981-12-21
JPS57162371A (en) *	1981-03-30	1982-10-06	Seiko Epson Corp	Mos semiconductor memory device
JPS5838625U (ja) *	1981-09-07	1983-03-14	岩野　勝	二分シュ−ト
JPS6148424A (ja) *	1984-08-13	1986-03-10	Tokuyama Soda Co Ltd	導電性を有する含水珪酸の製造方法

1987
- 1987-07-09 JP JP10543087U patent/JPH0735432Y2/ja not_active Expired - Lifetime

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS56172970U (fr) *	1980-05-20	1981-12-21
JPS57162371A (en) *	1981-03-30	1982-10-06	Seiko Epson Corp	Mos semiconductor memory device
JPS5838625U (ja) *	1981-09-07	1983-03-14	岩野　勝	二分シュ−ト
JPS6148424A (ja) *	1984-08-13	1986-03-10	Tokuyama Soda Co Ltd	導電性を有する含水珪酸の製造方法

Also Published As

Publication number	Publication date
JPH0735432Y2 (ja)	1995-08-09

Publication	Publication Date	Title
JPS5827935U (ja)	1983-02-23	混成集積回路装置
JPS6413144U (fr)	1989-01-24
JPS6413143U (fr)	1989-01-24
JPS6361150U (fr)	1988-04-22
JPS6413146U (fr)	1989-01-24
JPH0254234U (fr)	1990-04-19
JPS62134254U (fr)	1987-08-24
JPH022835U (fr)	1990-01-10
JPS6384941U (fr)	1988-06-03
JPS63187330U (fr)	1988-11-30
JPH03120052U (fr)	1991-12-10
JPS6273551U (fr)	1987-05-11
JPS61196219U (fr)	1986-12-06
JPS5842940U (ja)	1983-03-23	混成集積回路装置
JPS61173191U (fr)	1986-10-28
JPS6151737U (fr)	1986-04-07
JPH0265349U (fr)	1990-05-16
JPS62134240U (fr)	1987-08-24
JPS6219751U (fr)	1987-02-05
JPS6192064U (fr)	1986-06-14
JPS63149546U (fr)	1988-10-03
JPH0165142U (fr)	1989-04-26
JPS62172101U (fr)	1987-10-31
JPS61207068U (fr)	1986-12-27
JPS60109344U (ja)	1985-07-25	チツプ化半導体素子