JPS6413155U - - Google Patents
Info
- Publication number
- JPS6413155U JPS6413155U JP1987107185U JP10718587U JPS6413155U JP S6413155 U JPS6413155 U JP S6413155U JP 1987107185 U JP1987107185 U JP 1987107185U JP 10718587 U JP10718587 U JP 10718587U JP S6413155 U JPS6413155 U JP S6413155U
- Authority
- JP
- Japan
- Prior art keywords
- bypass capacitor
- built
- package
- lead frame
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例を示すバイパスコン
デンサ内蔵ＩＣの側面図、第２図及び第３図は従
来例を示すもので、第２図はＩＣ及びバイパスコ
ンデンサを実装したプリント基板の斜視図、第３
図はプリント基板の裏面図である。
１……ＩＣパツケージ、５……バイパスコンデ
ンサ。
Fig. 1 is a side view of an IC with a built-in bypass capacitor showing an embodiment of the present invention, Figs. 2 and 3 show conventional examples, and Fig. 2 is a perspective view of a printed circuit board on which the IC and bypass capacitor are mounted. Figure, 3rd
The figure is a back view of the printed circuit board. 1...IC package, 5...bypass capacitor.
Claims (1)
を内蔵したことを特徴とするバイパスコンデンサ
内蔵ＩＣ。 (2) 前記バイパスコンデンサが、パツケージ内
に設けたプラス電極と誘電体層とグランド電極と
の三層構造からなる実用新案登録請求の範囲第(1
)項に記載のバイパスコンデンサ内蔵ＩＣ。 (3) 前記プラス電極がＩＣ本体のプラス側リー
ドフレームに接続され、かつ、前記グランド電極
がＩＣ本体のグランド側リードフレームに接続さ
れている実用新案登録請求の範囲第(1)項に記載
のバイパスコンデンサ内蔵ＩＣ。 (4) 前記バイパスコンデンサ上にＩＣダイが配
置されている実用新案登録請求の範囲第(1)項に
記載のバイパスコンデンサ内蔵ＩＣ。[Scope of Claim for Utility Model Registration] (1) An IC with a built-in bypass capacitor characterized by having a built-in bypass capacitor in an IC package. (2) The bypass capacitor has a three-layer structure consisting of a positive electrode, a dielectric layer, and a ground electrode provided in the package.
IC with a built-in bypass capacitor described in section ). (3) The utility model according to claim 1, wherein the positive electrode is connected to the positive lead frame of the IC body, and the ground electrode is connected to the ground lead frame of the IC body. IC with built-in bypass capacitor. (4) The IC with a built-in bypass capacitor according to claim (1), wherein an IC die is arranged on the bypass capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987107185U JPS6413155U (en) | 1987-07-13 | 1987-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987107185U JPS6413155U (en) | 1987-07-13 | 1987-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413155U true JPS6413155U (en) | 1989-01-24 |
Family
ID=31341369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987107185U Pending JPS6413155U (en) | 1987-07-13 | 1987-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413155U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11772879B2 (en) | 2013-08-27 | 2023-10-03 | Coledy Inc. | Content receiving device, opening/closing mechanism, and container mechanism comprising the same |
-
1987
- 1987-07-13 JP JP1987107185U patent/JPS6413155U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11772879B2 (en) | 2013-08-27 | 2023-10-03 | Coledy Inc. | Content receiving device, opening/closing mechanism, and container mechanism comprising the same |