JPS6413341A - Wafer conveying device - Google Patents

Wafer conveying device

Info

Publication number
JPS6413341A
JPS6413341A JP16631287A JP16631287A JPS6413341A JP S6413341 A JPS6413341 A JP S6413341A JP 16631287 A JP16631287 A JP 16631287A JP 16631287 A JP16631287 A JP 16631287A JP S6413341 A JPS6413341 A JP S6413341A
Authority
JP
Japan
Prior art keywords
wafer
arms
pair
shaped
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16631287A
Other languages
Japanese (ja)
Inventor
Harutaka Koshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16631287A priority Critical patent/JPS6413341A/en
Publication of JPS6413341A publication Critical patent/JPS6413341A/en
Pending legal-status Critical Current

Links

Landscapes

  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To make it possible to prevent dust from adhering to a back surface of a wafer by providing plural projections on an upper surface of a pair of bar-shaped arms to place the wafer on their surfaces. CONSTITUTION:In a pair of bar-shaped arms 2 whose surface have plural projections 4 to place a wafer 1, the projections 4 are formed into a sharp- pointed round halberd shape, and their tips come into contact with the back surface of the wafer 1. A driving mechanism moves the arms 2 to convey the wafer 1 to a fixed position. Since a spot where the pair of the arms 2 come into contact with the wafer 1 is point-shaped, a contact area of the wafer 1 can be reduced to prevent dust on the arms 2 from hardly adhering to the wafer 1.
JP16631287A 1987-07-02 1987-07-02 Wafer conveying device Pending JPS6413341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16631287A JPS6413341A (en) 1987-07-02 1987-07-02 Wafer conveying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16631287A JPS6413341A (en) 1987-07-02 1987-07-02 Wafer conveying device

Publications (1)

Publication Number Publication Date
JPS6413341A true JPS6413341A (en) 1989-01-18

Family

ID=15829012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16631287A Pending JPS6413341A (en) 1987-07-02 1987-07-02 Wafer conveying device

Country Status (1)

Country Link
JP (1) JPS6413341A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351240A (en) * 1989-07-19 1991-03-05 Fujitsu Ltd Manufacturing device for semiconductor parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351240A (en) * 1989-07-19 1991-03-05 Fujitsu Ltd Manufacturing device for semiconductor parts

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