JPS6414929A - Chip fixing tape - Google Patents
Chip fixing tapeInfo
- Publication number
- JPS6414929A JPS6414929A JP62171617A JP17161787A JPS6414929A JP S6414929 A JPS6414929 A JP S6414929A JP 62171617 A JP62171617 A JP 62171617A JP 17161787 A JP17161787 A JP 17161787A JP S6414929 A JPS6414929 A JP S6414929A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- base material
- adhesive layer
- material layer
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 abstract 5
- 239000010410 layer Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 3
- 238000010030 laminating Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To make it possible to recognize the pattern of a chip positively and readily, by laminating an adhesive layer for bonding a chip on a base material layer, and laminating a reflection preventing film for light between the tape adhesive layer, on which light for detecting the chip is projected, and the base material layer. CONSTITUTION:A piece of tape 10 is composed of the following parts: a base material layer 11 comprising plastics or the like, which has a specified thickness and can be expanded; a reflection preventing film 12, which is laminated on the base material layer 11; and an adhesive layer 13, which is laminated on the reflection preventing film 12. The tape 10 is cut at a size or shape, which is larger than the diameter of a semiconductor wafer. Under the state the semiconductor wafer is bonded to the adhesive layer 13, the device undergoes a dicing step. After the dicing, the tape 10 is expanded, and the semiconductor chip 14 is separated into individual pieces on the tape 10. The reflection preventing film 12, which is inserted between the base material layer 11 and the adhesive layer 13, can be formed by, e.g., coating a film, whose thickness corresponds to the wavelength of projected light. The thickness of the film to be coated is adjusted in correspondence with the expanding rate of the tape after dicing.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62171617A JPS6414929A (en) | 1987-07-09 | 1987-07-09 | Chip fixing tape |
| KR1019880008295A KR910006367B1 (en) | 1987-07-09 | 1988-07-05 | Chip fixing tape |
| CA000571589A CA1325292C (en) | 1987-07-09 | 1988-07-08 | Adhesive tape for bonding chips thereon |
| EP88110940A EP0298496B1 (en) | 1987-07-09 | 1988-07-08 | Adhesive tape for bonding chips thereon |
| DE3851721T DE3851721T2 (en) | 1987-07-09 | 1988-07-08 | Adhesive tape for holding chips on it. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62171617A JPS6414929A (en) | 1987-07-09 | 1987-07-09 | Chip fixing tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6414929A true JPS6414929A (en) | 1989-01-19 |
Family
ID=15926493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62171617A Pending JPS6414929A (en) | 1987-07-09 | 1987-07-09 | Chip fixing tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6414929A (en) |
-
1987
- 1987-07-09 JP JP62171617A patent/JPS6414929A/en active Pending
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