JPS6414937A - Prober - Google Patents
ProberInfo
- Publication number
- JPS6414937A JPS6414937A JP17161487A JP17161487A JPS6414937A JP S6414937 A JPS6414937 A JP S6414937A JP 17161487 A JP17161487 A JP 17161487A JP 17161487 A JP17161487 A JP 17161487A JP S6414937 A JPS6414937 A JP S6414937A
- Authority
- JP
- Japan
- Prior art keywords
- probes
- pads
- deep
- brought
- probe board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 abstract 17
- 239000004065 semiconductor Substances 0.000 abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 244000144985 peep Species 0.000 abstract 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To expand applicability and to decrease replacing frequency of probe cards, by providing deep probes so as to correspond to each pad of a semiconductor element, which has different arrangement of the pads and lifting the probes, which do not correspond to the pads of the semiconductor element to be inspected. CONSTITUTION:In a probe board 1, a copper foil is etched end a specified wiring pattern is formed. Many deep probes 3 and 4 are attached to the probe board 1. The deep probes 3 and 4 are arranged around a positioning peep hole 2 in the probe board 1. The base parts of the probes are connected to the wiring layer of the probe board 1. The tips of the probes are bent downward and brought into contact with pads 11 of a semiconductor element 10 of a semiconductor wafer. Thus, inspection is performed. A grounding rod 7, which is provided at the upper parts of the deep probes 3 and 6 is formed in an annular shape so that all the deep probes 3 and 4 can be brought into contact therewith. The facing corner parts of the rod is connected to the probe board 1 and grounded. Only the deep probes corresponding to the pads of the semiconductor element 10 to be inspected are brought into contact with the pads. The deep probes, which do not correspond to the pads, are lifted by the driving with driving means 5 and 6 so that the probes are not brought into contact with the pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17161487A JPS6414937A (en) | 1987-07-09 | 1987-07-09 | Prober |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17161487A JPS6414937A (en) | 1987-07-09 | 1987-07-09 | Prober |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6414937A true JPS6414937A (en) | 1989-01-19 |
Family
ID=15926436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17161487A Pending JPS6414937A (en) | 1987-07-09 | 1987-07-09 | Prober |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6414937A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004045089A (en) * | 2002-07-09 | 2004-02-12 | Fujitsu Ltd | Probe card and semiconductor test equipment |
| WO2018078752A1 (en) * | 2016-10-26 | 2018-05-03 | 三菱電機株式会社 | Inspection device and inspection method |
-
1987
- 1987-07-09 JP JP17161487A patent/JPS6414937A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004045089A (en) * | 2002-07-09 | 2004-02-12 | Fujitsu Ltd | Probe card and semiconductor test equipment |
| WO2018078752A1 (en) * | 2016-10-26 | 2018-05-03 | 三菱電機株式会社 | Inspection device and inspection method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3586106B2 (en) | Probe card for IC test equipment | |
| JPS6464285A (en) | Printed board | |
| JPS6453429A (en) | Device for testing semiconductor chip | |
| JPS612338A (en) | Inspection equipment | |
| JPS5546578A (en) | Method of mounting integrated circuit | |
| JPH0629359A (en) | Guide mask type probe board | |
| JPH0328465U (en) | ||
| JPS5793543A (en) | Measuring system for semiconductor element | |
| JPH06308163A (en) | Probe device | |
| JPH069134U (en) | Probe board with diagonal linear probe | |
| JPH04365344A (en) | Probe card | |
| JPS62108874U (en) | ||
| JPH0341466Y2 (en) | ||
| JP2008226880A (en) | Circuit board and electrical connection device using the same | |
| JPH0342566U (en) | ||
| KR200148651Y1 (en) | Socket for semiconductor bga package test | |
| JPS62162979A (en) | Individual air cylinder type universal fixture | |
| JP2980952B2 (en) | Probe board | |
| JPH0191268U (en) | ||
| JPS57113243A (en) | Stationary probe board | |
| KR20020016286A (en) | Probe card for wafer prober | |
| JPS56148063A (en) | Multipin type probe station | |
| JPS62157145U (en) | ||
| JPH0283477U (en) | ||
| JPS6146464Y2 (en) |