JPS6416637U - - Google Patents
Info
- Publication number
- JPS6416637U JPS6416637U JP11218587U JP11218587U JPS6416637U JP S6416637 U JPS6416637 U JP S6416637U JP 11218587 U JP11218587 U JP 11218587U JP 11218587 U JP11218587 U JP 11218587U JP S6416637 U JPS6416637 U JP S6416637U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pattern shape
- semiconductor element
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図はこの考案の平面図、第２図はこの考案
に半導体素子を実装した断面図、第３図は従来例
の平面図、第４図は従来例に半導体素子を実装し
た断面図である。
１……回路基板、２……半田バンプ接続ランド
、３……電極接続用パターン、４……流出用パタ
ーン、５……半導体素子、６……半田。
Figure 1 is a plan view of this invention, Figure 2 is a sectional view of this invention with a semiconductor element mounted on it, Figure 3 is a plan view of a conventional example, and Figure 4 is a sectional view of a conventional example with a semiconductor element mounted on it. be. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Solder bump connection land, 3... Electrode connection pattern, 4... Outflow pattern, 5... Semiconductor element, 6... Solder.
Claims (1)
板のパターン形状において、前記回路基板上に配
設された半田バンプ接続用ランドに、１ないし複
数の流出用パターンを設けた事を特徴とする回路
基板のパターン形状。 A circuit board characterized in that, in a pattern shape of a circuit board on which a semiconductor element with solder bumps is mounted, one or more outflow patterns are provided on solder bump connection lands arranged on the circuit board. pattern shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11218587U JPS6416637U (en) | 1987-07-22 | 1987-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11218587U JPS6416637U (en) | 1987-07-22 | 1987-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6416637U true JPS6416637U (en) | 1989-01-27 |
Family
ID=31350893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11218587U Pending JPS6416637U (en) | 1987-07-22 | 1987-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6416637U (en) |
-
1987
- 1987-07-22 JP JP11218587U patent/JPS6416637U/ja active Pending