JPS6416941A - Method for detecting latent stress of structure - Google Patents

Method for detecting latent stress of structure

Info

Publication number
JPS6416941A
JPS6416941A JP17371387A JP17371387A JPS6416941A JP S6416941 A JPS6416941 A JP S6416941A JP 17371387 A JP17371387 A JP 17371387A JP 17371387 A JP17371387 A JP 17371387A JP S6416941 A JPS6416941 A JP S6416941A
Authority
JP
Japan
Prior art keywords
stress
latent stress
heating
destruction
latent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17371387A
Other languages
Japanese (ja)
Inventor
Shigeo Ohama
Hiroshi Nakane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TSUSHIN DOBOKU CONSULTANT KK
Original Assignee
TSUSHIN DOBOKU CONSULTANT KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TSUSHIN DOBOKU CONSULTANT KK filed Critical TSUSHIN DOBOKU CONSULTANT KK
Priority to JP17371387A priority Critical patent/JPS6416941A/en
Publication of JPS6416941A publication Critical patent/JPS6416941A/en
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

PURPOSE:To detect the latent stress of a structure without any destruction while using surface strain generated by heating without any destruction as a medium only by heating the surface of the structure. CONSTITUTION:An upper load P is supported on the structure 1, e.g. a concrete column, so unknown latent stress is accumulated as its reaction and surface stress epsilonx corresponding to the latent stress is generated. The latent stress can be detected nondestructively by using the surface stain generated as a medium without any destruction only by heating the surface of the structure 1. Further, the measuring instrument consisting of a heating device, a surface strain gauge 3, a display meter operated by the strain gauge 3, etc., is prepared to detect the latent stress of an optional selective position at an actual site according to the situation.
JP17371387A 1987-07-11 1987-07-11 Method for detecting latent stress of structure Pending JPS6416941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17371387A JPS6416941A (en) 1987-07-11 1987-07-11 Method for detecting latent stress of structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17371387A JPS6416941A (en) 1987-07-11 1987-07-11 Method for detecting latent stress of structure

Publications (1)

Publication Number Publication Date
JPS6416941A true JPS6416941A (en) 1989-01-20

Family

ID=15965751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17371387A Pending JPS6416941A (en) 1987-07-11 1987-07-11 Method for detecting latent stress of structure

Country Status (1)

Country Link
JP (1) JPS6416941A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166919A (en) * 1991-07-11 1992-11-24 International Business Machines Corporation Atomic scale electronic switch
KR100564329B1 (en) * 2002-08-17 2006-03-27 김남호 Image Processing Technique for Analysis of Plastic Deformation Behavior of Asphalt Mixtures
US7238547B2 (en) 2005-04-04 2007-07-03 International Business Machines Corporation Packaging integrated circuits for accelerated detection of transient particle induced soft error rates
JP2009014606A (en) * 2007-07-06 2009-01-22 Hitachi Ltd Residual stress measuring device and residual stress measuring method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166919A (en) * 1991-07-11 1992-11-24 International Business Machines Corporation Atomic scale electronic switch
KR100564329B1 (en) * 2002-08-17 2006-03-27 김남호 Image Processing Technique for Analysis of Plastic Deformation Behavior of Asphalt Mixtures
US7238547B2 (en) 2005-04-04 2007-07-03 International Business Machines Corporation Packaging integrated circuits for accelerated detection of transient particle induced soft error rates
JP2009014606A (en) * 2007-07-06 2009-01-22 Hitachi Ltd Residual stress measuring device and residual stress measuring method

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