JPS6417478U - - Google Patents
Info
- Publication number
- JPS6417478U JPS6417478U JP11291087U JP11291087U JPS6417478U JP S6417478 U JPS6417478 U JP S6417478U JP 11291087 U JP11291087 U JP 11291087U JP 11291087 U JP11291087 U JP 11291087U JP S6417478 U JPS6417478 U JP S6417478U
- Authority
- JP
- Japan
- Prior art keywords
- socket body
- retaining plate
- socket
- outer frame
- contact pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案にかかるＩＣソケツトを示す図
、第２図はフラツトパツケージの斜視図、第３図
は従来のＩＣソケツトを示す図である。
図において、１はパツケージ本体、２はリード
、１０はフラツトパツケージ、２１はソケツト本
体、２２はコンタクトピン、２３はストツパ、２
４はシヤフト、５０は押え板、５１は外枠、５２
は押え部材、５３は軸、５４は押え部材５２の圧
端部、を示している。
FIG. 1 is a diagram showing an IC socket according to the present invention, FIG. 2 is a perspective view of a flat package, and FIG. 3 is a diagram showing a conventional IC socket. In the figure, 1 is the package body, 2 is the lead, 10 is the flat package, 21 is the socket body, 22 is the contact pin, 23 is the stopper, 2
4 is a shaft, 50 is a holding plate, 51 is an outer frame, 52
53 indicates a shaft, and 54 indicates a pressure end portion of the presser member 52.
Claims (1)
体に押え板を重ねてパツケージのリードを前記ソ
ケツト本体のコンタクトピンに押圧する構造を有
し、前記押え板が外枠と該外枠に軸支された押え
部材とから構成されて、該押え部材が押え板の開
閉動作に無関係に絶えず水平に保持され、前記ソ
ケツト本体に載置されたパツケージ周囲のリード
を前記ソケツト本体のコンタクトピンに同時に押
圧するように構成したことを特徴とするＩＣソケ
ツト。 It has a structure in which a retaining plate is hinged to the socket body, and the retaining plate is stacked on the socket body to press the leads of the package against the contact pins of the socket body, and the retaining plate is pivotally supported by the outer frame and the outer frame. and a presser member that is held horizontally regardless of the opening/closing operation of the presser plate, and simultaneously presses the leads around the package placed on the socket body against the contact pins of the socket body. An IC socket characterized in that it is configured to do so.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11291087U JPS6417478U (en) | 1987-07-22 | 1987-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11291087U JPS6417478U (en) | 1987-07-22 | 1987-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6417478U true JPS6417478U (en) | 1989-01-27 |
Family
ID=31352278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11291087U Pending JPS6417478U (en) | 1987-07-22 | 1987-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6417478U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7859066B2 (en) | 2007-06-20 | 2010-12-28 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of manufacturing the same |
-
1987
- 1987-07-22 JP JP11291087U patent/JPS6417478U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7859066B2 (en) | 2007-06-20 | 2010-12-28 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of manufacturing the same |