JPS6417865A - Substrate-holding mechanism in equipment for thin film manufacture - Google Patents

Substrate-holding mechanism in equipment for thin film manufacture

Info

Publication number
JPS6417865A
JPS6417865A JP17314587A JP17314587A JPS6417865A JP S6417865 A JPS6417865 A JP S6417865A JP 17314587 A JP17314587 A JP 17314587A JP 17314587 A JP17314587 A JP 17314587A JP S6417865 A JPS6417865 A JP S6417865A
Authority
JP
Japan
Prior art keywords
substrate
holding plate
thin film
contact
scratched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17314587A
Other languages
Japanese (ja)
Other versions
JPH0733574B2 (en
Inventor
Tadashi Mizutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP17314587A priority Critical patent/JPH0733574B2/en
Publication of JPS6417865A publication Critical patent/JPS6417865A/en
Publication of JPH0733574B2 publication Critical patent/JPH0733574B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To prevent a substrate or a thin film from being scratched, by coating the surface, to be in contact with a substrate, of a substrate-holding plate with a silicone-type parting agent at the time of forming a thin film on a substrate. CONSTITUTION:A transparent plastic substrate 4 is held in a cylindrical void part provided to a holding plate 2 and having inside diameter and thickness larger than those of the substrate 4, to which a center masking cap 5 is attached. This holding plate 2 is set on a tray 1, and then, the inside of a sputtering chamber is reduced to high vacuum and the tray 1 is vertically rotated, by which the substrate 4 is subjected to rotation and revolution to undergo film formation. At this time, the part in which the holding plate 2 is brought into contact with the substrate, that is, the outside-peripheral masking part is coated with a silicone-type or fluorine-type parting agent 3. By this method, hardness is reduced and lubricity is increased at the contact surface between the substrate 4 and the holding plate 2 and the rotation and revolution of the substrate is smoothed, by which the substrate 4 or the thin film can be prevented from being scratched.
JP17314587A 1987-07-10 1987-07-10 Substrate holding mechanism in thin film manufacturing equipment Expired - Lifetime JPH0733574B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17314587A JPH0733574B2 (en) 1987-07-10 1987-07-10 Substrate holding mechanism in thin film manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17314587A JPH0733574B2 (en) 1987-07-10 1987-07-10 Substrate holding mechanism in thin film manufacturing equipment

Publications (2)

Publication Number Publication Date
JPS6417865A true JPS6417865A (en) 1989-01-20
JPH0733574B2 JPH0733574B2 (en) 1995-04-12

Family

ID=15954944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17314587A Expired - Lifetime JPH0733574B2 (en) 1987-07-10 1987-07-10 Substrate holding mechanism in thin film manufacturing equipment

Country Status (1)

Country Link
JP (1) JPH0733574B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254765A (en) * 1988-08-19 1990-02-23 Matsushita Electric Ind Co Ltd Thin film forming equipment
FR2750788A1 (en) * 1996-07-02 1998-01-09 Sony Corp Direct current electrode sputtering equipment for optical disc manufacture
US6837574B2 (en) 1999-12-28 2005-01-04 Hitachi Printing Solutions, Ltd. Line scan type ink jet recording device
FR3022808A1 (en) * 2014-06-26 2016-01-01 Valeo Vision SURFACE TREATMENT MASK OF A WORKPIECE AND METHOD OF MANUFACTURING SUCH A MASK

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254765A (en) * 1988-08-19 1990-02-23 Matsushita Electric Ind Co Ltd Thin film forming equipment
FR2750788A1 (en) * 1996-07-02 1998-01-09 Sony Corp Direct current electrode sputtering equipment for optical disc manufacture
US6022462A (en) * 1996-07-02 2000-02-08 Sony Corporation DC sputtering system
US6837574B2 (en) 1999-12-28 2005-01-04 Hitachi Printing Solutions, Ltd. Line scan type ink jet recording device
FR3022808A1 (en) * 2014-06-26 2016-01-01 Valeo Vision SURFACE TREATMENT MASK OF A WORKPIECE AND METHOD OF MANUFACTURING SUCH A MASK

Also Published As

Publication number Publication date
JPH0733574B2 (en) 1995-04-12

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Legal Events

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