JPS6419607A - Anisotropic conductive sheet - Google Patents

Anisotropic conductive sheet

Info

Publication number
JPS6419607A
JPS6419607A JP17436787A JP17436787A JPS6419607A JP S6419607 A JPS6419607 A JP S6419607A JP 17436787 A JP17436787 A JP 17436787A JP 17436787 A JP17436787 A JP 17436787A JP S6419607 A JPS6419607 A JP S6419607A
Authority
JP
Japan
Prior art keywords
sheet
insulation sheet
viscosity
anisotropic conductive
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17436787A
Other languages
Japanese (ja)
Inventor
Akio Yamaguchi
Mitsunobu Ryotoku
Wataru Kakimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP17436787A priority Critical patent/JPS6419607A/en
Publication of JPS6419607A publication Critical patent/JPS6419607A/en
Pending legal-status Critical Current

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  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE:To obtain an anisotropic conductive sheet capable of maintaining an anisotropical structure after connection by preventing fluidization of an electrical insulation sheet by arranging it such that a clearance between conductive members is 5-100mum, the insulation sheet has thermally fused characteristic, and the viscosity in a thermally fusable temperature is 1X10<4>-1X10<6> poise. CONSTITUTION:A sheet formed of synthetic resin and rubber showing adhesiveness by heat and pressure can be used as an electrical insulation sheet 2, while hot melt resin can be used as the synthetic resin. Alloy powder, fiber or carbon powder having as its main component metal powder of zinc, tin, Fe, silver, gold and the like can also be used as a conductive material 3. An anisotropic conductive sheet 1 have a clearance of 5-100mum between the adjacent conductive materials 3 thereof, and the insulation sheet 2 has thermally fused characteristic, and further the viscosity in thermally fusable temperature is controlled in a range of 1X10<4>-1X10<6> poise. It is thus possible to control fluidization of resin by controlling the viscosity of the insulation sheet 2 so as to enable the maintainace of connection and insulation characteristics in a practical use after bonding process.
JP17436787A 1987-07-13 1987-07-13 Anisotropic conductive sheet Pending JPS6419607A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17436787A JPS6419607A (en) 1987-07-13 1987-07-13 Anisotropic conductive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17436787A JPS6419607A (en) 1987-07-13 1987-07-13 Anisotropic conductive sheet

Publications (1)

Publication Number Publication Date
JPS6419607A true JPS6419607A (en) 1989-01-23

Family

ID=15977377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17436787A Pending JPS6419607A (en) 1987-07-13 1987-07-13 Anisotropic conductive sheet

Country Status (1)

Country Link
JP (1) JPS6419607A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001051580A1 (en) * 2000-01-13 2001-07-19 Nitto Denko Corporation Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001051580A1 (en) * 2000-01-13 2001-07-19 Nitto Denko Corporation Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof
US7056406B2 (en) 2000-01-13 2006-06-06 Nitto Denko Corporation Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

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