JPS6419786A - Semiconductor laser package - Google Patents

Semiconductor laser package

Info

Publication number
JPS6419786A
JPS6419786A JP62174720A JP17472087A JPS6419786A JP S6419786 A JPS6419786 A JP S6419786A JP 62174720 A JP62174720 A JP 62174720A JP 17472087 A JP17472087 A JP 17472087A JP S6419786 A JPS6419786 A JP S6419786A
Authority
JP
Japan
Prior art keywords
cap
reference plane
sub
face
mount block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62174720A
Other languages
Japanese (ja)
Other versions
JPH0797690B2 (en
Inventor
Kazuo Shigeno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62174720A priority Critical patent/JPH0797690B2/en
Publication of JPS6419786A publication Critical patent/JPS6419786A/en
Publication of JPH0797690B2 publication Critical patent/JPH0797690B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis

Landscapes

  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To enable application of a package of this design to a device which demands a high precision by a method wherein at least one reference plane is formed with an accuracy of 1 deg. or higher in relative angle with reference to an element pellet mounting face on a sub-mount block and the element pellet is encapsulated in a cap taking advantage of the reference plane so as to improve the element pellet in angular accuracy with reference to the package. CONSTITUTION:A sub-mount block 7 of copper, of which section is a irregular shape, is fixed in a piece on the upper face of a stem base 1 through a Ag-Cu brazing. The sub-mount block 7 is composed of such a structure as an inner vertical face 7a of the sub-mount block is a mounting face for a semiconductor laser element pellet and an outer vertical face 7b facing the face 7a is a reference plane used for an angle alignment. These faces 7a and 7b are structured with the accuracy by 1 deg. or less in a relative angle as parallel planes. When the stem which is structured as mentioned above is encapsulated in a cap (not shown in Figure), the stem is fixed after an angle alignment of it is performed as a reference plane jig is pressed against the reference plane 7b firmly not producing the looseness and thereafter the cap is put on after the jig is taken off and the angle alignment of the cap is also performed, then the cap is encapsulated as it is clamped.
JP62174720A 1987-07-15 1987-07-15 Semiconductor laser container Expired - Lifetime JPH0797690B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62174720A JPH0797690B2 (en) 1987-07-15 1987-07-15 Semiconductor laser container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62174720A JPH0797690B2 (en) 1987-07-15 1987-07-15 Semiconductor laser container

Publications (2)

Publication Number Publication Date
JPS6419786A true JPS6419786A (en) 1989-01-23
JPH0797690B2 JPH0797690B2 (en) 1995-10-18

Family

ID=15983471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62174720A Expired - Lifetime JPH0797690B2 (en) 1987-07-15 1987-07-15 Semiconductor laser container

Country Status (1)

Country Link
JP (1) JPH0797690B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61153360U (en) * 1985-03-14 1986-09-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61153360U (en) * 1985-03-14 1986-09-22

Also Published As

Publication number Publication date
JPH0797690B2 (en) 1995-10-18

Similar Documents

Publication Publication Date Title
EP0179577A3 (en) Method for making a semiconductor device having conductor pins
MY105095A (en) Semiconductor device having an improved lead arrangement and method for manufacturing the same.
KR100730906B1 (en) Lead frame device and manufacturing method thereof
KR910007042B1 (en) Assembly method of semiconductor laser
JPS55118643A (en) Wire bonding process
MY105031A (en) Resin-sealed type semiconductor device and method for manufacturing the same.
DE3268183D1 (en) Method of producing a pedestal for mounting a semiconductor chip on the base of an encapsulating housing
JPH0233979A (en) Optical semiconductor device
JPS62115834A (en) Semiconductor sealing device
KR100252228B1 (en) Semiconductor package and its making method
JPS57112055A (en) Integrated circuit package
JPS6430274A (en) Optical semiconductor element package
JP2948382B2 (en) Package type semiconductor laser device
EP0204102A3 (en) Direct connection of lead frame having flexible, tapered leads and mechanical die support
EP0070692A3 (en) Semiconductor device passivation
JPS57211259A (en) Semiconductor device
JPS60257159A (en) Semiconductor device
JPS62188293A (en) Semiconductor laser device
JPS6464341A (en) Photosemiconductor package
JPS5522818A (en) Method of semiconductor pressure sensor chip
JPS60180127A (en) Manufacture of resin sealed type semiconductor device
JPS5451477A (en) Mounting method of semiconductor chip
JPS55121655A (en) Manufacture of semiconductor device
JPH0741166Y2 (en) Package for semiconductor device
JPS63137488A (en) Optical semiconductor device