JPS6420213A - Photocurable resin composition - Google Patents
Photocurable resin compositionInfo
- Publication number
- JPS6420213A JPS6420213A JP17632187A JP17632187A JPS6420213A JP S6420213 A JPS6420213 A JP S6420213A JP 17632187 A JP17632187 A JP 17632187A JP 17632187 A JP17632187 A JP 17632187A JP S6420213 A JPS6420213 A JP S6420213A
- Authority
- JP
- Japan
- Prior art keywords
- component
- reactive compound
- photocurable
- 15pts
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 2
- 239000005062 Polybutadiene Substances 0.000 abstract 2
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 2
- 239000003999 initiator Substances 0.000 abstract 2
- 229920002857 polybutadiene Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 abstract 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 abstract 1
- 125000003396 thiol group Chemical group [H]S* 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
PURPOSE:To obtain the title composition excellent in adhesion to metals, ceramics, etc. and useful for sealing electronic components etc., by adding a mercapto silane coupling agent to a mixture comprising a specified reactive compound and a photopolymerization initiator. CONSTITUTION:A reactive compound (a) containing a photocurable polybutadiene resin is obtained by mixing 100pts.wt. photocurable telechelic polybutadiene resin (i) having an MW of 500-5,000 and photo/radical-polymerizable functional groups on molecular ends with 20-230pts.wt. reactive compound (ii) other than component (i) which is a reactive monomer or oligomer having a terminal group radical-polymerizable with component (i) (e.g., phenoxypolyethylene glycol acrylate). 0.5-15pts.wt. silane coupling agent (B) having at least one mercapto group in the molecule (e.g., 3-mercaptopropyltrimethoxysilane) is added to a mixture (A) comprising 100pts.wt. component (a) and 0.1-15pts.wt. photopolymerization initiator (b) (e.g., alpha-hydroxyisobutyrophenone).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17632187A JPS6420213A (en) | 1987-07-15 | 1987-07-15 | Photocurable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17632187A JPS6420213A (en) | 1987-07-15 | 1987-07-15 | Photocurable resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420213A true JPS6420213A (en) | 1989-01-24 |
Family
ID=16011539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17632187A Pending JPS6420213A (en) | 1987-07-15 | 1987-07-15 | Photocurable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420213A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6048587A (en) * | 1998-10-01 | 2000-04-11 | Ricon Resins, Inc. | Water-dispersible, radiation and thermally-curable polymeric compositions |
| US6809155B2 (en) * | 2002-11-20 | 2004-10-26 | National Starch And Chemical Investment Holding Corporation | Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
| US6818256B2 (en) * | 2000-12-01 | 2004-11-16 | Nichiban Company Limited | Energy curable sealant composition |
| JP2006298964A (en) * | 2005-04-15 | 2006-11-02 | Bridgestone Corp | Photocurable sealant composition and member with seal layer using the same |
| JP2013098393A (en) * | 2011-11-01 | 2013-05-20 | Fujitsu Ltd | Manufacturing method of electronic apparatus |
| JP2015162415A (en) * | 2014-02-28 | 2015-09-07 | 古河電気工業株式会社 | Resin composition for sealing electronic device and electronic device |
| JP2015160921A (en) * | 2014-02-28 | 2015-09-07 | 古河電気工業株式会社 | Resin composition of sealing of electronic device and electronic device |
-
1987
- 1987-07-15 JP JP17632187A patent/JPS6420213A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6048587A (en) * | 1998-10-01 | 2000-04-11 | Ricon Resins, Inc. | Water-dispersible, radiation and thermally-curable polymeric compositions |
| US6818256B2 (en) * | 2000-12-01 | 2004-11-16 | Nichiban Company Limited | Energy curable sealant composition |
| US6809155B2 (en) * | 2002-11-20 | 2004-10-26 | National Starch And Chemical Investment Holding Corporation | Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
| JP2006298964A (en) * | 2005-04-15 | 2006-11-02 | Bridgestone Corp | Photocurable sealant composition and member with seal layer using the same |
| JP2013098393A (en) * | 2011-11-01 | 2013-05-20 | Fujitsu Ltd | Manufacturing method of electronic apparatus |
| JP2015162415A (en) * | 2014-02-28 | 2015-09-07 | 古河電気工業株式会社 | Resin composition for sealing electronic device and electronic device |
| JP2015160921A (en) * | 2014-02-28 | 2015-09-07 | 古河電気工業株式会社 | Resin composition of sealing of electronic device and electronic device |
| US10196547B2 (en) | 2014-02-28 | 2019-02-05 | Furukawa Electrics Co., Ltd. | Resin composition for sealing electronic device, and electronic device |
| US10196534B2 (en) | 2014-02-28 | 2019-02-05 | Furukawa Electric Co., Ltd. | Resin composition for sealing electronic device, and electronic device |
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