JPS6420280A - Electroconductive adhesive - Google Patents

Electroconductive adhesive

Info

Publication number
JPS6420280A
JPS6420280A JP17387687A JP17387687A JPS6420280A JP S6420280 A JPS6420280 A JP S6420280A JP 17387687 A JP17387687 A JP 17387687A JP 17387687 A JP17387687 A JP 17387687A JP S6420280 A JPS6420280 A JP S6420280A
Authority
JP
Japan
Prior art keywords
adhesive
cu2s
cus
electroconductive adhesive
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17387687A
Other languages
Japanese (ja)
Inventor
Yoshio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP17387687A priority Critical patent/JPS6420280A/en
Publication of JPS6420280A publication Critical patent/JPS6420280A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To obtain an inexpensive electroconductive adhesive which can keep high conductivity for a long time, by adding a Cu2S or CuS powder to an adhesive as a base and kneading the mixture. CONSTITUTION:An electroconductive adhesive is formed by adding at least either a Cu2S powder or a CuS powder of which at least the surface is Cu2S or CuS to an adhesive as a base and kneading the mixture. By the addition of Cu2S or CuS which is a stable sulfide and has a high electroconductivity to an adhesive, the obtained adhesive can retain its electroconductivity for a long time. Since the above conductive additive is not expensive unlike Au or the like, an electroconductive adhesive can be inexpensively provided.
JP17387687A 1987-07-14 1987-07-14 Electroconductive adhesive Pending JPS6420280A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17387687A JPS6420280A (en) 1987-07-14 1987-07-14 Electroconductive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17387687A JPS6420280A (en) 1987-07-14 1987-07-14 Electroconductive adhesive

Publications (1)

Publication Number Publication Date
JPS6420280A true JPS6420280A (en) 1989-01-24

Family

ID=15968764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17387687A Pending JPS6420280A (en) 1987-07-14 1987-07-14 Electroconductive adhesive

Country Status (1)

Country Link
JP (1) JPS6420280A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015129336A (en) * 2014-01-08 2015-07-16 住友金属鉱山株式会社 Copper sulfide-coated copper powder, conductive paste and production methods of them
CN109082262A (en) * 2018-08-13 2018-12-25 广东泰强化工实业有限公司 A kind of infrared fast curable water-borne based on CuS photothermal conversion mechanism crosses machine glue and coating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015129336A (en) * 2014-01-08 2015-07-16 住友金属鉱山株式会社 Copper sulfide-coated copper powder, conductive paste and production methods of them
CN109082262A (en) * 2018-08-13 2018-12-25 广东泰强化工实业有限公司 A kind of infrared fast curable water-borne based on CuS photothermal conversion mechanism crosses machine glue and coating method

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