JPS6420699A - Radiating structure of electronic component - Google Patents

Radiating structure of electronic component

Info

Publication number
JPS6420699A
JPS6420699A JP62177682A JP17768287A JPS6420699A JP S6420699 A JPS6420699 A JP S6420699A JP 62177682 A JP62177682 A JP 62177682A JP 17768287 A JP17768287 A JP 17768287A JP S6420699 A JPS6420699 A JP S6420699A
Authority
JP
Japan
Prior art keywords
electronic component
electronic components
pipe
radiating means
radiating structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62177682A
Other languages
Japanese (ja)
Inventor
Jiyun Sakiura
Katsushi Arai
Yasushi Kojima
Mitsuaki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62177682A priority Critical patent/JPS6420699A/en
Publication of JPS6420699A publication Critical patent/JPS6420699A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To shorten a gap between electronic components, by mounting a heat pipe vertically and in such a manner that a part of a radiating means is located on the side of a board opposite to its mounting side. CONSTITUTION:A heat pipe 28 is connected to a printed board 24 in which an electronic component 12 is mounted on one face thereof. The pipe is mounted vertically to the board. A radiating means 30 and 32 is installed on the top of the pipe to radiate generated heat from the electronic component 12. A part of the radiating means 30 and 32 is installed in such a manner as to be located opposite to the mounting side. According to the constitution, a space where electronic components are mountable can be increased and a gap between neighboring electronic components can be shortened.
JP62177682A 1987-07-15 1987-07-15 Radiating structure of electronic component Pending JPS6420699A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62177682A JPS6420699A (en) 1987-07-15 1987-07-15 Radiating structure of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62177682A JPS6420699A (en) 1987-07-15 1987-07-15 Radiating structure of electronic component

Publications (1)

Publication Number Publication Date
JPS6420699A true JPS6420699A (en) 1989-01-24

Family

ID=16035263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62177682A Pending JPS6420699A (en) 1987-07-15 1987-07-15 Radiating structure of electronic component

Country Status (1)

Country Link
JP (1) JPS6420699A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353192A (en) * 1993-02-08 1994-10-04 At&T Bell Laboratories Circuit card assembly
WO2003088022A1 (en) * 2002-04-06 2003-10-23 Zalman Tech Co., Ltd Chipset cooling device of video graphic adapter card
JP2010067660A (en) * 2008-09-09 2010-03-25 Fujitsu Ltd Electronic device and component for the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353192A (en) * 1993-02-08 1994-10-04 At&T Bell Laboratories Circuit card assembly
WO2003088022A1 (en) * 2002-04-06 2003-10-23 Zalman Tech Co., Ltd Chipset cooling device of video graphic adapter card
JP2005520260A (en) * 2002-04-06 2005-07-07 ザルマン テック カンパニー リミテッド VGA card chipset cooling device
US6937474B2 (en) 2002-04-06 2005-08-30 Zalman Tech Co. Ltd. Chipset cooling device of video graphic adapter card
JP2010067660A (en) * 2008-09-09 2010-03-25 Fujitsu Ltd Electronic device and component for the same

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