JPS6420747U - - Google Patents
Info
- Publication number
- JPS6420747U JPS6420747U JP1987115425U JP11542587U JPS6420747U JP S6420747 U JPS6420747 U JP S6420747U JP 1987115425 U JP1987115425 U JP 1987115425U JP 11542587 U JP11542587 U JP 11542587U JP S6420747 U JPS6420747 U JP S6420747U
- Authority
- JP
- Japan
- Prior art keywords
- island
- leads
- lead frame
- branched
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例とアイランドに載置
されたＩＣチツプの平面模式図、第２図は第１図
の実施例を組立たＩＣの効果を説明するための等
価回路図、第３図は従来のリードフレームの一例
とアイランドに載置されたＩＣチツプの平面模式
図、第４図は第３図の実施例を組立たＩＣの問題
点を説明するための等価回路図である。
２……アイランド、Ｌ……外部ピン、ｌｐ……
電流パルス用内部リード、ｌｓ……小信号用内部
リード。
FIG. 1 is a schematic plan view of an embodiment of the present invention and an IC chip mounted on an island, FIG. 2 is an equivalent circuit diagram for explaining the effect of an IC assembled from the embodiment of FIG. 1, and FIG. Fig. 3 is a schematic plan view of an example of a conventional lead frame and an IC chip mounted on an island, and Fig. 4 is an equivalent circuit diagram for explaining the problems of the IC assembled using the embodiment shown in Fig. 3. . 2...Island, L...External pin, lp...
Internal lead for current pulse, ls...Internal lead for small signal.
Claims (1)
金属帯板に連続して設けたリードフレームにおい
て、少なくとも１つの前記リードの前記アイラン
ド側が分岐されていることを特徴とするリードフ
レーム。 1. A lead frame in which a region in which a plurality of leads surround an island is continuously provided on a metal band plate, wherein at least one of the leads is branched on the island side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115425U JPS6420747U (en) | 1987-07-27 | 1987-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115425U JPS6420747U (en) | 1987-07-27 | 1987-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420747U true JPS6420747U (en) | 1989-02-01 |
Family
ID=31357069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987115425U Pending JPS6420747U (en) | 1987-07-27 | 1987-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420747U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571030A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Mounting system for semiconductor device |
| JPS5878448A (en) * | 1982-10-18 | 1983-05-12 | Hitachi Ltd | Package for integrated circuit |
| JPS6119151A (en) * | 1984-07-05 | 1986-01-28 | Nec Corp | Semiconductor device |
| JPS6211256A (en) * | 1985-07-09 | 1987-01-20 | Fujitsu Ltd | Semiconductor integrated circuit device |
| JPS6214748B2 (en) * | 1984-02-08 | 1987-04-03 | Hitachi Ltd |
-
1987
- 1987-07-27 JP JP1987115425U patent/JPS6420747U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571030A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Mounting system for semiconductor device |
| JPS5878448A (en) * | 1982-10-18 | 1983-05-12 | Hitachi Ltd | Package for integrated circuit |
| JPS6214748B2 (en) * | 1984-02-08 | 1987-04-03 | Hitachi Ltd | |
| JPS6119151A (en) * | 1984-07-05 | 1986-01-28 | Nec Corp | Semiconductor device |
| JPS6211256A (en) * | 1985-07-09 | 1987-01-20 | Fujitsu Ltd | Semiconductor integrated circuit device |