JPS6420764U - - Google Patents
Info
- Publication number
- JPS6420764U JPS6420764U JP11556287U JP11556287U JPS6420764U JP S6420764 U JPS6420764 U JP S6420764U JP 11556287 U JP11556287 U JP 11556287U JP 11556287 U JP11556287 U JP 11556287U JP S6420764 U JPS6420764 U JP S6420764U
- Authority
- JP
- Japan
- Prior art keywords
- metal foils
- wiring board
- printed wiring
- base material
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す略線的断面図
、第２図は本考案の他の実施例を示す略線的断面
図、第３図は従来のプリント配線基板の説明に供
する略線的断面図である。
１，１０…プリント配線基板、２…基材、３Ａ
，３Ｂ…銅箔、４…両面銅張積層板、５…導電性
ペースト、６…スルーホール、７，１１…端面部
、８…亀裂。
Fig. 1 is a schematic sectional view showing one embodiment of the present invention, Fig. 2 is a schematic sectional view showing another embodiment of the invention, and Fig. 3 is for explaining a conventional printed wiring board. It is a schematic cross-sectional view. 1, 10...Printed wiring board, 2...Base material, 3A
, 3B...Copper foil, 4...Double-sided copper-clad laminate, 5...Conductive paste, 6...Through hole, 7, 11...End surface portion, 8...Crack.
Claims (1)
張つてなる積層板を有し、当該第１及び第２の金
属箔及び上記基材を貫通してなる貫通孔の内面及
び上記第１及び第２の金属箔上に導電性ペースト
でなる接続部材を付着させることにより、上記第
１及び第２の金属箔間を電気的に接続するプリン
ト配線基板において、 上記貫通孔を構成する上記第１及び第２の金属
箔の表面側の端面部を面取りするようにした ことを特徴とするプリント配線基板。[Claims for Utility Model Registration] A laminate comprising a laminate in which first and second metal foils are pasted on the upper and lower surfaces of a base material, the first and second metal foils and the base material being penetrated. In a printed wiring board that electrically connects the first and second metal foils by attaching a connecting member made of conductive paste to the inner surface of the through hole and the first and second metal foils. . A printed wiring board, characterized in that the first and second metal foils constituting the through hole are chamfered at the end face portions on the front surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11556287U JPS6420764U (en) | 1987-07-28 | 1987-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11556287U JPS6420764U (en) | 1987-07-28 | 1987-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420764U true JPS6420764U (en) | 1989-02-01 |
Family
ID=31357334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11556287U Pending JPS6420764U (en) | 1987-07-28 | 1987-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420764U (en) |
-
1987
- 1987-07-28 JP JP11556287U patent/JPS6420764U/ja active Pending