JPS6421931A - Semiconductor substrate - Google Patents

Semiconductor substrate

Info

Publication number
JPS6421931A
JPS6421931A JP62177792A JP17779287A JPS6421931A JP S6421931 A JPS6421931 A JP S6421931A JP 62177792 A JP62177792 A JP 62177792A JP 17779287 A JP17779287 A JP 17779287A JP S6421931 A JPS6421931 A JP S6421931A
Authority
JP
Japan
Prior art keywords
layer
nickel
thickness
layers
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62177792A
Other languages
Japanese (ja)
Inventor
Hideko Fukushima
Yusuke Iyori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP62177792A priority Critical patent/JPS6421931A/en
Publication of JPS6421931A publication Critical patent/JPS6421931A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a highly heat conductive substrate characterized by high adhesion of laminated layers and improved wettability with solder or brazing filler, metal by forming a first layer comprising titanium, chromium and the like on the surface of the substrate comprising aluminum nitride, forming a second layer comprising a thin film of nickel or copper, forming a third layer comprising nickel or copper, and laminating these layers. CONSTITUTION:A first layer comprising one or more kinds of titanium, chromiun, molybdenum and tungsten is formed on the surface of a substrate comprising aluminum nitride. A second layer comprising a thin film of nickel or copper is formed. A third layer comprising nickel or copper is formed. These layers are sequentially laminated. It is desirable that said first and second layers are formed by a physical evaporating means and the third layer is formed by a plating means. For example, the chromium layer having a thickness of 2,000Angstrom and the nickel layer having a thickness of 5,000Angstrom are sequentially formed as the first and second layers by sputtering method on the surface of the sintered aluminum nitride plate having a thickness of 2mm. As the third layer, electrolytic plating of nickel is performed to a thickness of 4mum. As an uppermost layer, electrolytic plating of gold is performed to a thickness of 0.5mum, and a semiconductor substrate is formed.
JP62177792A 1987-07-16 1987-07-16 Semiconductor substrate Pending JPS6421931A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62177792A JPS6421931A (en) 1987-07-16 1987-07-16 Semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62177792A JPS6421931A (en) 1987-07-16 1987-07-16 Semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS6421931A true JPS6421931A (en) 1989-01-25

Family

ID=16037179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62177792A Pending JPS6421931A (en) 1987-07-16 1987-07-16 Semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS6421931A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121862A (en) * 1991-10-30 1993-05-18 Fujitsu Ltd Indium resistant solder pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121862A (en) * 1991-10-30 1993-05-18 Fujitsu Ltd Indium resistant solder pattern

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