JPS6422097A - Manufacture of metal base printed circuit board having through hole on both sides - Google Patents

Manufacture of metal base printed circuit board having through hole on both sides

Info

Publication number
JPS6422097A
JPS6422097A JP17938187A JP17938187A JPS6422097A JP S6422097 A JPS6422097 A JP S6422097A JP 17938187 A JP17938187 A JP 17938187A JP 17938187 A JP17938187 A JP 17938187A JP S6422097 A JPS6422097 A JP S6422097A
Authority
JP
Japan
Prior art keywords
hole
resin
inorganic filler
plating
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17938187A
Other languages
Japanese (ja)
Inventor
Shinichi Kato
Yoshiyuki Ikezoe
Matsuo Kato
Eikichi Sato
Junichi Kato
Fumio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP17938187A priority Critical patent/JPS6422097A/en
Publication of JPS6422097A publication Critical patent/JPS6422097A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To improve workability, reliability and heat resistance, by sealing a resin tablet filled with inorganic filler of a specified volume % in a through hole, making a fine through hole in the central part of sealed and thermoset resin, and plating the fine through hole with metal to constitute electrical continuity. CONSTITUTION:By heating and pressing, copper foils 1 are bonded and stacked, via a thermosetting resin layer, on both sides of a metal plate 3 of a laminated plate, both surfaces of which are coated with copper. On the laminated plate, a through hole 4 is made, in which a resin tablet 5 highly filled with inorganic filler is inserted. By heating and pressing applying thermal press and the like, the resin 5 is bonded and hardened to the surface of the through hole 4, and both of the surfaces are flattened. The resin tablet is filled with inorganic filler of 40-70 of volume %. At the central part of the buried resin 5, a penetrating thin hole 6 as a through hole is formed, and then through hole plating (which is usually copper plating) is applied to the penetrating thin hole and its peripheral part.
JP17938187A 1987-07-17 1987-07-17 Manufacture of metal base printed circuit board having through hole on both sides Pending JPS6422097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17938187A JPS6422097A (en) 1987-07-17 1987-07-17 Manufacture of metal base printed circuit board having through hole on both sides

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17938187A JPS6422097A (en) 1987-07-17 1987-07-17 Manufacture of metal base printed circuit board having through hole on both sides

Publications (1)

Publication Number Publication Date
JPS6422097A true JPS6422097A (en) 1989-01-25

Family

ID=16064862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17938187A Pending JPS6422097A (en) 1987-07-17 1987-07-17 Manufacture of metal base printed circuit board having through hole on both sides

Country Status (1)

Country Link
JP (1) JPS6422097A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763843A (en) * 1996-06-19 1998-06-09 Mitsubishi Denki Kabushiki Kaisha Device and method for electrical discharge machining
WO2001011662A3 (en) * 1999-08-11 2001-05-17 Tessera Inc Vapor phase connection techniques
JP2002204076A (en) * 2000-12-28 2002-07-19 Ibiden Co Ltd Multilayer printed wiring board and method of manufacture the same
JP2002204075A (en) * 2000-12-28 2002-07-19 Ibiden Co Ltd Method of manufacturing multilayer printed wiring board
JP2002204074A (en) * 2000-12-28 2002-07-19 Ibiden Co Ltd Multilayer printed wiring board
JP2002208778A (en) * 2001-01-10 2002-07-26 Ibiden Co Ltd Multilayer printed wiring board
JP2002217543A (en) * 2001-01-22 2002-08-02 Ibiden Co Ltd Multilayer printed wiring board
JP2002217542A (en) * 2001-01-22 2002-08-02 Ibiden Co Ltd Multilayer printed-wiring board
JP2002217541A (en) * 2001-01-22 2002-08-02 Ibiden Co Ltd Multilayer printed wiring board
JP2007103698A (en) * 2005-10-05 2007-04-19 Fujikura Ltd Wiring board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763843A (en) * 1996-06-19 1998-06-09 Mitsubishi Denki Kabushiki Kaisha Device and method for electrical discharge machining
DE19710458B4 (en) * 1996-06-19 2006-05-04 Mitsubishi Denki K.K. Method for spark erosive machining
WO2001011662A3 (en) * 1999-08-11 2001-05-17 Tessera Inc Vapor phase connection techniques
JP2002204076A (en) * 2000-12-28 2002-07-19 Ibiden Co Ltd Multilayer printed wiring board and method of manufacture the same
JP2002204075A (en) * 2000-12-28 2002-07-19 Ibiden Co Ltd Method of manufacturing multilayer printed wiring board
JP2002204074A (en) * 2000-12-28 2002-07-19 Ibiden Co Ltd Multilayer printed wiring board
JP2002208778A (en) * 2001-01-10 2002-07-26 Ibiden Co Ltd Multilayer printed wiring board
JP2002217543A (en) * 2001-01-22 2002-08-02 Ibiden Co Ltd Multilayer printed wiring board
JP2002217542A (en) * 2001-01-22 2002-08-02 Ibiden Co Ltd Multilayer printed-wiring board
JP2002217541A (en) * 2001-01-22 2002-08-02 Ibiden Co Ltd Multilayer printed wiring board
JP2007103698A (en) * 2005-10-05 2007-04-19 Fujikura Ltd Wiring board

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