JPS6423599A - Multilayer circuit substrate of mullite ceramic material and semiconductor module - Google Patents
Multilayer circuit substrate of mullite ceramic material and semiconductor moduleInfo
- Publication number
- JPS6423599A JPS6423599A JP62178935A JP17893587A JPS6423599A JP S6423599 A JPS6423599 A JP S6423599A JP 62178935 A JP62178935 A JP 62178935A JP 17893587 A JP17893587 A JP 17893587A JP S6423599 A JPS6423599 A JP S6423599A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gas
- multilayer circuit
- circuit substrate
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052863 mullite Inorganic materials 0.000 title abstract 2
- 229910010293 ceramic material Inorganic materials 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000463 material Substances 0.000 abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 230000000630 rising effect Effects 0.000 abstract 2
- 239000002344 surface layer Substances 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910000833 kovar Inorganic materials 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To obtain a multilayer circuit substrate having high reliability and fast signal processing speed by employing a material to which one or more oxides of group IIIa elements are added in specific amount for the substrate material. CONSTITUTION:A front surface layer 1 and a rear surface layer 3 employs a sintered material to which 0.1-10 pts. wt. of oxide of a group IIIa element as a sintering assistant for a mullite material is added. Silica material is used for an insulating layer 2 disposed near line wirings. After conductors are wired, a laminated substrate is manufactured by a laminating press, the profile of the substrate is cut, and set in a furnace. It is heated at 50 deg.C/hr of temperature rising speed up to 1200 deg.C in an (N2 gas + H2 gas) atmosphere containing steam for extracting resin. Then, it is heated at 100 deg.C/hr of temperature rising speed in the N2 gas + H2 gas atmosphere, temporarily held at 1600 deg.C of the highest temperature for 1 hour to form a ceramic multilayer circuit substrate. The substrate thus formed is electroless nickel-plated and gold-plated, a kovar pin 4 is connected by a normal method using a carbon jig in a gold-germanium furnace 8, and an Si chip 6 is directly placed by a solder 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62178935A JPS6423599A (en) | 1987-07-20 | 1987-07-20 | Multilayer circuit substrate of mullite ceramic material and semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62178935A JPS6423599A (en) | 1987-07-20 | 1987-07-20 | Multilayer circuit substrate of mullite ceramic material and semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6423599A true JPS6423599A (en) | 1989-01-26 |
Family
ID=16057216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62178935A Pending JPS6423599A (en) | 1987-07-20 | 1987-07-20 | Multilayer circuit substrate of mullite ceramic material and semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6423599A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1690842A1 (en) * | 2005-02-11 | 2006-08-16 | IBT InfraBioTech GmbH | Ceramic compostion and light source for processing plastic materials |
| JP2010098049A (en) * | 2008-10-15 | 2010-04-30 | Ngk Spark Plug Co Ltd | Multilayer ceramic substrate and method for manufacturing the same |
| CN110026705A (en) * | 2019-03-08 | 2019-07-19 | 南昌大学 | A kind of coating and its preparation process of enhancing Sn base solder/Kovar alloy interconnection welding spot reliability |
| US12374894B2 (en) | 2019-03-28 | 2025-07-29 | Nuvve Corporation | Multi-technology grid regulation service |
-
1987
- 1987-07-20 JP JP62178935A patent/JPS6423599A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1690842A1 (en) * | 2005-02-11 | 2006-08-16 | IBT InfraBioTech GmbH | Ceramic compostion and light source for processing plastic materials |
| JP2010098049A (en) * | 2008-10-15 | 2010-04-30 | Ngk Spark Plug Co Ltd | Multilayer ceramic substrate and method for manufacturing the same |
| CN110026705A (en) * | 2019-03-08 | 2019-07-19 | 南昌大学 | A kind of coating and its preparation process of enhancing Sn base solder/Kovar alloy interconnection welding spot reliability |
| US12374894B2 (en) | 2019-03-28 | 2025-07-29 | Nuvve Corporation | Multi-technology grid regulation service |
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