JPS6424489A - Multilayered board for mounting ic chip - Google Patents
Multilayered board for mounting ic chipInfo
- Publication number
- JPS6424489A JPS6424489A JP18004587A JP18004587A JPS6424489A JP S6424489 A JPS6424489 A JP S6424489A JP 18004587 A JP18004587 A JP 18004587A JP 18004587 A JP18004587 A JP 18004587A JP S6424489 A JPS6424489 A JP S6424489A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- hole
- mounting
- copper
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- 229910001374 Invar Inorganic materials 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229910000942 Elinvar Inorganic materials 0.000 abstract 1
- 239000002648 laminated material Substances 0.000 abstract 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
PURPOSE:To improve an IC chip in a mounting, heat dissipating, and adhesion to resin property by a method wherein copper or aluminum is used as a mounting multi- layered laminated material for an IC and an IC chip mounting section is replaced with metal low in a thermal expansion coefficient after a hole is provided. CONSTITUTION:Concerning a multi-layered plate with, at least, a connecting terminal provided in its inner layer for an IC chip, a sheet of copper or aluminum 0.1-1.0mm in thickness is used as a multi-layered plate on which an IC chip is to be mounted. And, a hole for mounting of an IC chip or a hole with a prescribed diameter, if required, is provided at a required position thereon. And, a metal sheet, which is less than 9X10<-6>cm/cm/ deg.C in a thermal expansion coefficient, a little smaller in diameter than the hole for mounting of IC chip is inserted into the hole, and a hole optionally provided for a pin stand is sealed with resin, where these holes treated as mentioned above are used as they are in this state while the multi-layered plate is formed. A metal sheet such as an invar type alloy, an elinvar type alloy sheet or the like, or these sheets of which both sides copper is bonded onto or a copper/invar sheet is used for a metal sheet 9X10<-6>cm/cm/ deg.C in thermal expansion coefficient used for an IC mount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18004587A JPS6424489A (en) | 1987-07-21 | 1987-07-21 | Multilayered board for mounting ic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18004587A JPS6424489A (en) | 1987-07-21 | 1987-07-21 | Multilayered board for mounting ic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424489A true JPS6424489A (en) | 1989-01-26 |
Family
ID=16076522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18004587A Pending JPS6424489A (en) | 1987-07-21 | 1987-07-21 | Multilayered board for mounting ic chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424489A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932191A (en) * | 1982-08-18 | 1984-02-21 | イビデン株式会社 | Printed circuit board and method of producing same |
| JPS61288448A (en) * | 1985-06-17 | 1986-12-18 | Sumitomo Electric Ind Ltd | Semiconductor element mounting substrate |
-
1987
- 1987-07-21 JP JP18004587A patent/JPS6424489A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932191A (en) * | 1982-08-18 | 1984-02-21 | イビデン株式会社 | Printed circuit board and method of producing same |
| JPS61288448A (en) * | 1985-06-17 | 1986-12-18 | Sumitomo Electric Ind Ltd | Semiconductor element mounting substrate |
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