JPS6424837U - - Google Patents
Info
- Publication number
- JPS6424837U JPS6424837U JP12054187U JP12054187U JPS6424837U JP S6424837 U JPS6424837 U JP S6424837U JP 12054187 U JP12054187 U JP 12054187U JP 12054187 U JP12054187 U JP 12054187U JP S6424837 U JPS6424837 U JP S6424837U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- grinding
- surface formed
- parting surface
- cavity block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る半導体装置の樹脂封止装
置における下側型板を示す平面図、第２図ａおよ
びｂは樹脂封止後のリードフレームを示す斜視図
とそのＸ矢視図、第３図ａおよびｂは従来の半導
体装置の樹脂封止装置における下側型板を平面図
と断面図、第４図ａおよびｂは樹脂封止前のリー
ドフレームを示す斜視図とそのＹ矢視図、第５図
ａおよびｂは樹脂封止後のリードフレームを示す
斜視図とそのＺ矢視図である。
２１……キヤビテイブロツク、２１ａ……パー
テイング面、２２……突条、ａ……リードフレー
ム、Ｂ……圧延ロール痕、Ｂ１……凸部、Ｂ２…
…凹部。
FIG. 1 is a plan view showing a lower template in a resin sealing device for a semiconductor device according to the present invention, FIGS. 2 a and b are perspective views showing a lead frame after resin sealing and its view in the direction of the X arrow, Figures 3a and b are a plan view and a sectional view of a lower template in a conventional resin sealing device for semiconductor devices, and Figures 4a and b are perspective views showing the lead frame before resin sealing and its Y arrow. 5A and 5B are a perspective view and a Z-direction view of the lead frame after resin sealing. 21...Cavity block, 21a...Parting surface, 22...Protrusion, a...Lead frame, B...Rolling roll mark, B1 ...Protrusion, B2 ...
...concavity.
Claims (1)
されたパーテイング面を有しリードフレームを保
持するパツケージ形成用のキヤビテイブロツクを
備え、このキヤビテイブロツクの突条はフレーム
保持状態において前記リードフレームの圧延方向
と直角な方向に延在されていることを特徴とする
半導体装置の樹脂封止装置。 A cavity block for forming a package for holding a lead frame is provided, and a protrusion extending on one side has a parting surface formed by grinding, and the protrusion of this cavity block has a parting surface formed by grinding. A resin sealing device for a semiconductor device, characterized in that the device extends in a direction perpendicular to the rolling direction of a lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12054187U JPS6424837U (en) | 1987-08-05 | 1987-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12054187U JPS6424837U (en) | 1987-08-05 | 1987-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424837U true JPS6424837U (en) | 1989-02-10 |
Family
ID=31366742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12054187U Pending JPS6424837U (en) | 1987-08-05 | 1987-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424837U (en) |
-
1987
- 1987-08-05 JP JP12054187U patent/JPS6424837U/ja active Pending