JPS6424897U - - Google Patents
Info
- Publication number
- JPS6424897U JPS6424897U JP1987119023U JP11902387U JPS6424897U JP S6424897 U JPS6424897 U JP S6424897U JP 1987119023 U JP1987119023 U JP 1987119023U JP 11902387 U JP11902387 U JP 11902387U JP S6424897 U JPS6424897 U JP S6424897U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- covering
- resin mold
- electric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の電気素子の斜視図、第２図は
本考案の他の実施例である電気素子の斜視図、第
３図は従来の電気素子の断面図である。
１は電気素子、２は樹脂、３はリード、４は樹
脂部、５はシールド材である。
FIG. 1 is a perspective view of an electric device according to the present invention, FIG. 2 is a perspective view of an electric device according to another embodiment of the present invention, and FIG. 3 is a sectional view of a conventional electric device. 1 is an electric element, 2 is a resin, 3 is a lead, 4 is a resin part, and 5 is a shielding material.
Claims (1)
レームを樹脂モールドして成る電気素子に於いて
、この樹脂モールド部より露出しているリード部
を被覆して形成される樹脂部と、この樹脂部の一
部より前記樹脂モールド領域の全てを被覆するシ
ールド材を具備することを特徴とした電気素子。 In an electric element formed by resin-molding a lead frame on which a passive element and an active element are mounted, there is a resin part formed by covering the lead part exposed from the resin mold part, and a resin part formed by covering the lead part exposed from the resin mold part, and An electric element comprising a shielding material that partially covers all of the resin mold area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987119023U JPS6424897U (en) | 1987-08-03 | 1987-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987119023U JPS6424897U (en) | 1987-08-03 | 1987-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424897U true JPS6424897U (en) | 1989-02-10 |
Family
ID=31363890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987119023U Pending JPS6424897U (en) | 1987-08-03 | 1987-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7311877B2 (en) * | 2003-07-31 | 2007-12-25 | General Electric Company | Inhibition of corrosion in fluid systems |
-
1987
- 1987-08-03 JP JP1987119023U patent/JPS6424897U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7311877B2 (en) * | 2003-07-31 | 2007-12-25 | General Electric Company | Inhibition of corrosion in fluid systems |