JPS6425515U - - Google Patents

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Publication number
JPS6425515U
JPS6425515U JP11980187U JP11980187U JPS6425515U JP S6425515 U JPS6425515 U JP S6425515U JP 11980187 U JP11980187 U JP 11980187U JP 11980187 U JP11980187 U JP 11980187U JP S6425515 U JPS6425515 U JP S6425515U
Authority
JP
Japan
Prior art keywords
locking
protrusion
recess
parts
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11980187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11980187U priority Critical patent/JPS6425515U/ja
Publication of JPS6425515U publication Critical patent/JPS6425515U/ja
Pending legal-status Critical Current

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  • Connection Of Plates (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の1実施例の組付けられる部品
の分解斜視図、第2図は組付け直前状態を示す一
部破断した斜視図、第3図は蓋体の側面図、第4
図は従来例の分解斜視図、第5図は従来例のもの
に捩り応力が加わつてロツクが解除された状態を
示す正面図である。 1……本体、4……蓋体、6……係止凹部、7
……係止突起、8……ガイド用突起、9……ガイ
ド用凹部。
Fig. 1 is an exploded perspective view of parts to be assembled according to an embodiment of the present invention, Fig. 2 is a partially cutaway perspective view showing a state immediately before assembly, Fig. 3 is a side view of the lid, and Fig. 4 is a perspective view of parts to be assembled.
The figure is an exploded perspective view of the conventional example, and FIG. 5 is a front view showing the conventional example in a state where torsional stress is applied and the lock is released. 1... Main body, 4... Lid, 6... Locking recess, 7
... Locking projection, 8 ... Guide projection, 9 ... Guide recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 相対向して係止される部品の一方に係止突起を
設け、他方の部品に上記係止突起が係合する係止
凹部を設け、上記係止突起と係止凹部が係止する
ことにより組付けられる組付部品のロツク構造に
おいて、上記組付けられる部品の一方に係止位置
を決めるガイド用突起を設け、他方の部品に上記
ガイド用突起が嵌入するガイド用凹部を設け、上
記組付部品の組付けに際し上記係止突起が係止凹
部に係合を開始する前に、ガイド用突起がガイド
用凹部に嵌入する構成となつていることを特徴と
する組付部品のガイド付きロツク構造。
A locking protrusion is provided on one of the parts to be locked facing each other, a locking recess into which the locking protrusion engages is provided on the other part, and the locking protrusion and the locking recess are locked. In the locking structure of the assembly parts to be assembled, one of the parts to be assembled is provided with a guide protrusion that determines the locking position, and the other part is provided with a guide recess into which the guide protrusion fits; A guided lock structure for assembly parts, characterized in that the guiding protrusion fits into the guiding recess before the locking protrusion starts engaging with the locking recess when assembling the parts. .
JP11980187U 1987-08-06 1987-08-06 Pending JPS6425515U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11980187U JPS6425515U (en) 1987-08-06 1987-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11980187U JPS6425515U (en) 1987-08-06 1987-08-06

Publications (1)

Publication Number Publication Date
JPS6425515U true JPS6425515U (en) 1989-02-13

Family

ID=31365348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11980187U Pending JPS6425515U (en) 1987-08-06 1987-08-06

Country Status (1)

Country Link
JP (1) JPS6425515U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881615B2 (en) 1988-09-28 2005-04-19 Semiconductor Energy Laboratory Co., Ltd. Method for crystallizing semiconductor material without exposing it to air
JP2006071289A (en) * 2004-08-31 2006-03-16 Yazaki Corp Assembly structure of case member and cover member and vehicle-mounted instrument using the same
US7329906B2 (en) 1992-08-27 2008-02-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
JP2014084768A (en) * 2012-10-23 2014-05-12 Mahle Filter Systems Japan Corp Assembling structure of hollow component
JP2015117742A (en) * 2013-12-17 2015-06-25 カルソニックカンセイ株式会社 Mounting structure for in-vehicle equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881615B2 (en) 1988-09-28 2005-04-19 Semiconductor Energy Laboratory Co., Ltd. Method for crystallizing semiconductor material without exposing it to air
US7435635B2 (en) 1988-09-28 2008-10-14 Semiconductor Energy Laboratory Co., Ltd. Method for crystallizing semiconductor material
US7329906B2 (en) 1992-08-27 2008-02-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
US7416907B2 (en) 1992-08-27 2008-08-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
JP2006071289A (en) * 2004-08-31 2006-03-16 Yazaki Corp Assembly structure of case member and cover member and vehicle-mounted instrument using the same
JP2014084768A (en) * 2012-10-23 2014-05-12 Mahle Filter Systems Japan Corp Assembling structure of hollow component
JP2015117742A (en) * 2013-12-17 2015-06-25 カルソニックカンセイ株式会社 Mounting structure for in-vehicle equipment

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