JPS6427246A - Semiconductor unit and manufacture - Google Patents

Semiconductor unit and manufacture

Info

Publication number
JPS6427246A
JPS6427246A JP62184451A JP18445187A JPS6427246A JP S6427246 A JPS6427246 A JP S6427246A JP 62184451 A JP62184451 A JP 62184451A JP 18445187 A JP18445187 A JP 18445187A JP S6427246 A JPS6427246 A JP S6427246A
Authority
JP
Japan
Prior art keywords
lead
junction
metal layer
eutectic
bump electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62184451A
Other languages
Japanese (ja)
Inventor
Munehiro Yamada
Seiichi Ichihara
Yoshiaki Wakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP62184451A priority Critical patent/JPS6427246A/en
Publication of JPS6427246A publication Critical patent/JPS6427246A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To reduce load on bonding for improved reliability of junction by performing junction of valve electrode and lead on semiconductor pellet by forming eutectic (or alloy). CONSTITUTION:A small bonding load is applied to and heating is performed at a relatively low temperature while a metal 9C of lead 9 is in contact with the second metal layer 7B consisting of tin layer of bump electrode 7. As a result, the tin diffuses the first metal layer 7A consisting of the bump electrode metal layer and the lead metal layer 9C to form an eutectic of Au and Sn 10. the bonding load at this time is small as compared with the strength of a passivation film 5. It will prevent crack to be generated on the passivation film 5. Also, since the junction between the lead 9 and a bump electrode 7 is formed by eutectic (or alloy), the reliability of junction is great.
JP62184451A 1987-07-22 1987-07-22 Semiconductor unit and manufacture Pending JPS6427246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62184451A JPS6427246A (en) 1987-07-22 1987-07-22 Semiconductor unit and manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62184451A JPS6427246A (en) 1987-07-22 1987-07-22 Semiconductor unit and manufacture

Publications (1)

Publication Number Publication Date
JPS6427246A true JPS6427246A (en) 1989-01-30

Family

ID=16153380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62184451A Pending JPS6427246A (en) 1987-07-22 1987-07-22 Semiconductor unit and manufacture

Country Status (1)

Country Link
JP (1) JPS6427246A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215069A (en) * 1990-01-19 1991-09-20 Sharp Corp Character output processing method
US7753039B2 (en) 2006-06-08 2010-07-13 Toyota Jidosha Kabushiki Kaisha Exhaust gas control apparatus of an internal combustion engine
US7882820B2 (en) 2006-02-28 2011-02-08 Toyota Jidosha Kabushiki Kaisha Control apparatus of internal combustion engine and control method of internal combustion engine
US8141344B2 (en) 2006-07-25 2012-03-27 Toyota Jidosha Kabushiki Kaisha Control apparatus and control method of an internal combustion engine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215069A (en) * 1990-01-19 1991-09-20 Sharp Corp Character output processing method
US7882820B2 (en) 2006-02-28 2011-02-08 Toyota Jidosha Kabushiki Kaisha Control apparatus of internal combustion engine and control method of internal combustion engine
US7753039B2 (en) 2006-06-08 2010-07-13 Toyota Jidosha Kabushiki Kaisha Exhaust gas control apparatus of an internal combustion engine
US8141344B2 (en) 2006-07-25 2012-03-27 Toyota Jidosha Kabushiki Kaisha Control apparatus and control method of an internal combustion engine

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