JPS6427773A - Substrate heating device - Google Patents

Substrate heating device

Info

Publication number
JPS6427773A
JPS6427773A JP62182976A JP18297687A JPS6427773A JP S6427773 A JPS6427773 A JP S6427773A JP 62182976 A JP62182976 A JP 62182976A JP 18297687 A JP18297687 A JP 18297687A JP S6427773 A JPS6427773 A JP S6427773A
Authority
JP
Japan
Prior art keywords
substrate
mask
hole
heat
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62182976A
Other languages
Japanese (ja)
Inventor
Tomohide Hirono
Hiroyuki Naka
Takashi Ichiyanagi
Osamu Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62182976A priority Critical patent/JPS6427773A/en
Publication of JPS6427773A publication Critical patent/JPS6427773A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the generation of a defective soldering and the damage of a part by arranging the mask partially equipping the shielding material of a radiation heat between a heat source and the substrate on a supporting device. CONSTITUTION:A conveyor belt 13 as the supporting device of a substrate 12 is provided inside a heating device main body 11 and the pallet 16 mounting the substrate 12 thereon is arranged. The pallet 16 is composed of the two sheets of the base plate 17 at the lower part and the porous plate like mask 18 at the upper part. The mask 18 has large and small holes 19 and forms a large hole 19 corresponding to the large heat capacity place of the substrate 12 and no hole or small hole 19 for a small heat capacity place respectively. The temp. distribution of the substrate 12 passing through the lower part of heat sources 14, 15 is therefore controlled with high accuracy. Consequently the damage of a part caused by the detective soldering and overheating is surely prevented.
JP62182976A 1987-07-22 1987-07-22 Substrate heating device Pending JPS6427773A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62182976A JPS6427773A (en) 1987-07-22 1987-07-22 Substrate heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62182976A JPS6427773A (en) 1987-07-22 1987-07-22 Substrate heating device

Publications (1)

Publication Number Publication Date
JPS6427773A true JPS6427773A (en) 1989-01-30

Family

ID=16127595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62182976A Pending JPS6427773A (en) 1987-07-22 1987-07-22 Substrate heating device

Country Status (1)

Country Link
JP (1) JPS6427773A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254992A (en) * 1988-08-19 1990-02-23 Canon Inc Temperature control method when soldering electronic components to a board
US5234484A (en) * 1992-02-24 1993-08-10 Itt Corporation Method for annealing phosphors applied to surfaces having melting points below the annealing temperature of the phosphor
JPH06179074A (en) * 1992-12-11 1994-06-28 Nippondenso Co Ltd Heating furnace for brazing
JP2009290152A (en) * 2008-06-02 2009-12-10 Honda Motor Co Ltd Infrared reflow temperature controller

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339238B2 (en) * 1972-09-11 1978-10-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339238B2 (en) * 1972-09-11 1978-10-20

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254992A (en) * 1988-08-19 1990-02-23 Canon Inc Temperature control method when soldering electronic components to a board
US5234484A (en) * 1992-02-24 1993-08-10 Itt Corporation Method for annealing phosphors applied to surfaces having melting points below the annealing temperature of the phosphor
JPH06179074A (en) * 1992-12-11 1994-06-28 Nippondenso Co Ltd Heating furnace for brazing
JP2009290152A (en) * 2008-06-02 2009-12-10 Honda Motor Co Ltd Infrared reflow temperature controller

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