JPS6428247A - Composition for forming electrically conductive film - Google Patents
Composition for forming electrically conductive filmInfo
- Publication number
- JPS6428247A JPS6428247A JP18309787A JP18309787A JPS6428247A JP S6428247 A JPS6428247 A JP S6428247A JP 18309787 A JP18309787 A JP 18309787A JP 18309787 A JP18309787 A JP 18309787A JP S6428247 A JPS6428247 A JP S6428247A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- powder
- solder
- particle diameter
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 6
- 239000000843 powder Substances 0.000 abstract 7
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 3
- 229910052709 silver Inorganic materials 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 229910052718 tin Inorganic materials 0.000 abstract 3
- 239000011135 tin Substances 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 239000011701 zinc Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Landscapes
- Glass Compositions (AREA)
Abstract
PURPOSE:To obtain a composition capable of forming an electrically conductive film having excellent electric characteristics, adhesivity, oxidation resistance and solderability, by blending Ni powder with Ag, Sn, Zn, Al, Cu or solder and glass powder. CONSTITUTION:A composition containing (a) 100pts.wt. nickel powder, (b) 5-500 pts.wt. at least one of silver, tin, zinc, aluminum, copper and solder and (c) 1-200pts.wt. glass powder. The metal powder used has preferably about 0.05-100mu particle diameter. When the particle diameter is smaller than 0.05mu, the metal powder is apt to be readily oxidized, the metal powder is oxidized during preservation and the composition is unusable. On the other hand, when the particle diameter is larger than 100mu, unfavorably the composition can not be uniformly made into an alloy. The solder powder has a composition consisting of about 20-80wt.% Pb, about 80-20wt.% Sn and <=about 5wt.% other components such as Ag, Cu or Bi, is preferably made into an alloy previously and used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309787A JPS6428247A (en) | 1987-07-21 | 1987-07-21 | Composition for forming electrically conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309787A JPS6428247A (en) | 1987-07-21 | 1987-07-21 | Composition for forming electrically conductive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6428247A true JPS6428247A (en) | 1989-01-30 |
| JPH0475856B2 JPH0475856B2 (en) | 1992-12-02 |
Family
ID=16129712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18309787A Granted JPS6428247A (en) | 1987-07-21 | 1987-07-21 | Composition for forming electrically conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6428247A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7157023B2 (en) | 2001-04-09 | 2007-01-02 | E. I. Du Pont De Nemours And Company | Conductor compositions and the use thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59213639A (en) * | 1983-05-02 | 1984-12-03 | バロ−ス・コ−ポレ−シヨン | Glass composition and ink composition containing same |
-
1987
- 1987-07-21 JP JP18309787A patent/JPS6428247A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59213639A (en) * | 1983-05-02 | 1984-12-03 | バロ−ス・コ−ポレ−シヨン | Glass composition and ink composition containing same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7157023B2 (en) | 2001-04-09 | 2007-01-02 | E. I. Du Pont De Nemours And Company | Conductor compositions and the use thereof |
| US7914709B2 (en) | 2001-04-09 | 2011-03-29 | E.I. Du Pont De Nemours And Company | Conductor compositions and the use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0475856B2 (en) | 1992-12-02 |
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