JPS6428385A - Silver removing solution - Google Patents
Silver removing solutionInfo
- Publication number
- JPS6428385A JPS6428385A JP18374487A JP18374487A JPS6428385A JP S6428385 A JPS6428385 A JP S6428385A JP 18374487 A JP18374487 A JP 18374487A JP 18374487 A JP18374487 A JP 18374487A JP S6428385 A JPS6428385 A JP S6428385A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- silver
- soln
- hydrogen peroxide
- ammonium salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE:To enable the dissolution of a large amt. of silver by using a soln. contg. prescribed amts. of a prescribed chlorinated org. compd., an ammonium salt or a compd. having an amino group and/or an imino group and hydrogen peroxide. CONSTITUTION:This silver removing soln. contains 0.01-50g/l chlorinated org. compd., 0.01-70g/l ammonium salt and/or compd. having an amino group and/or an imino group and 1-250g/l hydrogen peroxide. The chlorinated org. compd. produces free chlorine ions in the soln., prevents the damage of a metal substrate, removes dissolved silver ions as silver chloride from a system and prevents deposition by substitution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18374487A JP2553574B2 (en) | 1987-07-24 | 1987-07-24 | Silver stripper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18374487A JP2553574B2 (en) | 1987-07-24 | 1987-07-24 | Silver stripper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6428385A true JPS6428385A (en) | 1989-01-30 |
| JP2553574B2 JP2553574B2 (en) | 1996-11-13 |
Family
ID=16141218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18374487A Expired - Lifetime JP2553574B2 (en) | 1987-07-24 | 1987-07-24 | Silver stripper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2553574B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004002946A (en) * | 2001-07-23 | 2004-01-08 | Sony Corp | Etching method and etching solution |
| JP2004172427A (en) * | 2002-11-21 | 2004-06-17 | Sony Corp | Etching solution and etching method |
| JP2004204266A (en) * | 2002-12-24 | 2004-07-22 | Tosoh Corp | Composition for dissolving tantalum and dissolution method using the same |
| JP2008534789A (en) * | 2005-04-06 | 2008-08-28 | インクテック シーオー リミテッド | Etching composition |
| JP2010261098A (en) * | 2009-05-07 | 2010-11-18 | Gyoseiin Genshino Iinkai Kakuno Kenkyusho | New metal nitrogen oxide process |
| JP2012193427A (en) * | 2011-03-17 | 2012-10-11 | Murata Mfg Co Ltd | Method for manufacturing electronic component |
| WO2020080178A1 (en) * | 2018-10-17 | 2020-04-23 | 株式会社Adeka | Etching liquid composition and etching method |
| WO2021117478A1 (en) * | 2019-12-12 | 2021-06-17 | 株式会社Adeka | Etching liquid composition and etching method |
| CN113881944A (en) * | 2020-07-01 | 2022-01-04 | 上海和辉光电股份有限公司 | Method for removing magnesium-silver alloy on surface of metal mask plate |
| CN118241211A (en) * | 2022-12-23 | 2024-06-25 | 贵州振华群英电器有限公司(国营第八九一厂) | Method and liquid for desilvering metal parts embedded in plastic |
| WO2025140403A1 (en) * | 2023-12-26 | 2025-07-03 | 叶涛 | Method for safe oxidative dissolution of metallic silver |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4478383B2 (en) * | 2002-11-26 | 2010-06-09 | 関東化学株式会社 | Etching solution composition for metal thin film mainly composed of silver |
-
1987
- 1987-07-24 JP JP18374487A patent/JP2553574B2/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004002946A (en) * | 2001-07-23 | 2004-01-08 | Sony Corp | Etching method and etching solution |
| JP2004172427A (en) * | 2002-11-21 | 2004-06-17 | Sony Corp | Etching solution and etching method |
| JP2004204266A (en) * | 2002-12-24 | 2004-07-22 | Tosoh Corp | Composition for dissolving tantalum and dissolution method using the same |
| JP2008534789A (en) * | 2005-04-06 | 2008-08-28 | インクテック シーオー リミテッド | Etching composition |
| JP2010261098A (en) * | 2009-05-07 | 2010-11-18 | Gyoseiin Genshino Iinkai Kakuno Kenkyusho | New metal nitrogen oxide process |
| JP2012193427A (en) * | 2011-03-17 | 2012-10-11 | Murata Mfg Co Ltd | Method for manufacturing electronic component |
| WO2020080178A1 (en) * | 2018-10-17 | 2020-04-23 | 株式会社Adeka | Etching liquid composition and etching method |
| CN112867812A (en) * | 2018-10-17 | 2021-05-28 | 株式会社Adeka | Etching liquid composition and etching method |
| JP7377212B2 (en) * | 2018-10-17 | 2023-11-09 | 株式会社Adeka | Etching solution composition and etching method |
| TWI863935B (en) * | 2018-10-17 | 2024-12-01 | 日商Adeka股份有限公司 | Etching method |
| WO2021117478A1 (en) * | 2019-12-12 | 2021-06-17 | 株式会社Adeka | Etching liquid composition and etching method |
| CN113881944A (en) * | 2020-07-01 | 2022-01-04 | 上海和辉光电股份有限公司 | Method for removing magnesium-silver alloy on surface of metal mask plate |
| CN118241211A (en) * | 2022-12-23 | 2024-06-25 | 贵州振华群英电器有限公司(国营第八九一厂) | Method and liquid for desilvering metal parts embedded in plastic |
| WO2025140403A1 (en) * | 2023-12-26 | 2025-07-03 | 叶涛 | Method for safe oxidative dissolution of metallic silver |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2553574B2 (en) | 1996-11-13 |
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