JPS6428518A - Method of measuring physical quantity - Google Patents
Method of measuring physical quantityInfo
- Publication number
- JPS6428518A JPS6428518A JP62184540A JP18454087A JPS6428518A JP S6428518 A JPS6428518 A JP S6428518A JP 62184540 A JP62184540 A JP 62184540A JP 18454087 A JP18454087 A JP 18454087A JP S6428518 A JPS6428518 A JP S6428518A
- Authority
- JP
- Japan
- Prior art keywords
- image
- moire fringes
- fringe patterns
- test piece
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Optical Transform (AREA)
Abstract
PURPOSE:To measure physical quantities of an object such as length, distortion, etc. with high accuracy even under the poor circumstances, by forming an image of lattice patterns equally spaced from one another on one end of a multi-core optical fiber and, observing moire fringes formed at the other end of the optical fiber. CONSTITUTION:In the case where the distortion is to be measured under the extremely low temperatures, a test piece 10 having latticed fringe patterns drawn in black-and-white thereon is placed in liquid helium. The image of the fringe patterns 1 is formed by an object lens 2 at one end of an image fiber 3. At this time, if the magnification of the object lens 2 is set in such manner that an interval between the fringe patterns of the formed image is equal to that of core arrays of the optical fiber 3, moire fringes are generated at the other end of the fiber 3. When the test piece 10 is deformed or distorted in the above-described state, the fringe patterns 1 are also deformed and the moire fringes are moved. Accordingly, if the amount of this movement of the moire fringes is arranged to be measured through a television monitor 6 or detected by an image processor 7, the distortion amount of the test piece can be measured with high accuracy even under the poor circumstances.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62184540A JP2573493B2 (en) | 1987-07-23 | 1987-07-23 | How to measure physical quantities |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62184540A JP2573493B2 (en) | 1987-07-23 | 1987-07-23 | How to measure physical quantities |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6428518A true JPS6428518A (en) | 1989-01-31 |
| JP2573493B2 JP2573493B2 (en) | 1997-01-22 |
Family
ID=16154991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62184540A Expired - Fee Related JP2573493B2 (en) | 1987-07-23 | 1987-07-23 | How to measure physical quantities |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2573493B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5747362A (en) * | 1991-10-18 | 1998-05-05 | U.S. Philips Corporation | Method of manufacturing a semiconductor device in which a layer of material is deposited on the surface of a semiconductor wafer from a process gas |
| JPWO2007142351A1 (en) * | 2006-06-09 | 2009-10-29 | 株式会社ニコン | MOBILE DEVICE, EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843654U (en) * | 1971-09-25 | 1973-06-06 | ||
| JPS58102105A (en) * | 1981-12-14 | 1983-06-17 | Hitachi Ltd | fiber optic sensor |
-
1987
- 1987-07-23 JP JP62184540A patent/JP2573493B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843654U (en) * | 1971-09-25 | 1973-06-06 | ||
| JPS58102105A (en) * | 1981-12-14 | 1983-06-17 | Hitachi Ltd | fiber optic sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5747362A (en) * | 1991-10-18 | 1998-05-05 | U.S. Philips Corporation | Method of manufacturing a semiconductor device in which a layer of material is deposited on the surface of a semiconductor wafer from a process gas |
| JPWO2007142351A1 (en) * | 2006-06-09 | 2009-10-29 | 株式会社ニコン | MOBILE DEVICE, EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2573493B2 (en) | 1997-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |