JPS6430292A - Hybrid integrated circuit and manufacture thereof - Google Patents

Hybrid integrated circuit and manufacture thereof

Info

Publication number
JPS6430292A
JPS6430292A JP18696887A JP18696887A JPS6430292A JP S6430292 A JPS6430292 A JP S6430292A JP 18696887 A JP18696887 A JP 18696887A JP 18696887 A JP18696887 A JP 18696887A JP S6430292 A JPS6430292 A JP S6430292A
Authority
JP
Japan
Prior art keywords
boards
joint members
circuit
circuit components
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18696887A
Other languages
Japanese (ja)
Inventor
Hiroshi Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP18696887A priority Critical patent/JPS6430292A/en
Publication of JPS6430292A publication Critical patent/JPS6430292A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To avoid deterioration and damage of circuit components caused by heat, mechanical bending force and so forth properly and reduce a cost by a method wherein at least one of a part of a plurality of the circuit components and a jumper board connecting between boards is employed to connect between the respective boards electrically and mechanically. CONSTITUTION:A glass-epoxy board 10 and an alumina board 11 are so arranged as to be brought into contact with each other. After joint members 14 are applied by screen printing to the predetermined positions on the respective circuit patterns 12 and 13 of the boards 10 and 11, respective circuit components are mounted on the respective joint members in accordance with the characteristics of the respective boards 10 and 11 and, at the same time, on the joint members 14, 14 ... near the connection part between the two boards 10 and 11, the circuit component such as a transformer 18 and a jumper board 19 are mounted. After that, the joint members 14 on the circuit patterns 12 and 13 are simultaneously heated and melted by a heater or the like and the circuit components are fixed and connected to the circuit patterns and the respective boards are connected to each other with the melted joint members.
JP18696887A 1987-07-27 1987-07-27 Hybrid integrated circuit and manufacture thereof Pending JPS6430292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18696887A JPS6430292A (en) 1987-07-27 1987-07-27 Hybrid integrated circuit and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18696887A JPS6430292A (en) 1987-07-27 1987-07-27 Hybrid integrated circuit and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6430292A true JPS6430292A (en) 1989-02-01

Family

ID=16197876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18696887A Pending JPS6430292A (en) 1987-07-27 1987-07-27 Hybrid integrated circuit and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6430292A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150079841A1 (en) * 2013-09-18 2015-03-19 Luxul Technology Incorporation Circuit board connector
WO2021244960A1 (en) * 2020-06-05 2021-12-09 Signify Holding B.V. Electronic circuit with isolation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150079841A1 (en) * 2013-09-18 2015-03-19 Luxul Technology Incorporation Circuit board connector
US9425522B2 (en) * 2013-09-18 2016-08-23 Luxul Technology Incorporation Circuit board connector
WO2021244960A1 (en) * 2020-06-05 2021-12-09 Signify Holding B.V. Electronic circuit with isolation
CN115700010A (en) * 2020-06-05 2023-02-03 昕诺飞控股有限公司 Electronic circuits with isolation
US12457672B2 (en) 2020-06-05 2025-10-28 Signify Holding B.V. Electronic circuit with isolation
CN115700010B (en) * 2020-06-05 2026-04-03 昕诺飞控股有限公司 Isolated electronic circuits

Similar Documents

Publication Publication Date Title
TW236070B (en)
GB2177642B (en) Assembly of electronic components
EP0276924A3 (en) Electrical connector for electrically connecting circuit elements disposed on two printed circuit boards
DE69427767D1 (en) Electrical connectors for coupling two printed circuit boards
IL85007A (en) Thermal technique for simultaneous testing of circuit board solder joints
EP0164949A3 (en) Programmable programmed socket
WO1998057357A3 (en) Multiple board package employing solder balls and fabrication method and apparatus
GB2262902A (en) Plated-through hole solder thief
CA2080094A1 (en) Multilayer circuit board with repaired i/o pin and process for repairing i/o pin on multilayer circuit board
CA2218460A1 (en) Mounting structure for a relay
EP0219059A3 (en) Apparatus for the hot tinning of circuit boards and process for soldering terminals of components to the conductive paths and soldering panels of a circuit board
US5438749A (en) Method of making a flex circuit interconnect for a microprocessor emulator and a method of testing
EP0126164A4 (en) METHOD FOR CONNECTING DOUBLE-SIDED CIRCUITS.
JPS6430292A (en) Hybrid integrated circuit and manufacture thereof
JPS6473909A (en) Noise filter
EP0214030A3 (en) Surface mount technology automated repair system
JPH01272189A (en) Method of correcting warpage of printed circuit board
JPH01272188A (en) Method of correcting warpage of printed circuit board
JPS6424492A (en) Coil device
JPS649689A (en) Circuit board
JP2000174161A (en) Flexible substrate and method for mounting semiconductor device using the same
JPH03205769A (en) Clip lead for hybrid integrated circuit
ES8702105A1 (en) Method for the production of printed circuit boards with more than four conductive layers.
JPS6439795A (en) Terminal structure of printed board
JPS6477988A (en) Printed wiring board