JPS6431424A - Manufacturing equipment for semiconductor - Google Patents

Manufacturing equipment for semiconductor

Info

Publication number
JPS6431424A
JPS6431424A JP62186732A JP18673287A JPS6431424A JP S6431424 A JPS6431424 A JP S6431424A JP 62186732 A JP62186732 A JP 62186732A JP 18673287 A JP18673287 A JP 18673287A JP S6431424 A JPS6431424 A JP S6431424A
Authority
JP
Japan
Prior art keywords
paste
retaining
coated
frame
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62186732A
Other languages
Japanese (ja)
Inventor
Kiyoshi Takaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP62186732A priority Critical patent/JPS6431424A/en
Publication of JPS6431424A publication Critical patent/JPS6431424A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent a lead frame from levitating, to uniformize wettability of liquid-like adhesive paste and to eliminate the irregularity of a bonding strength by retaining the frame by a retaining lever, and retaining the coated paste by a retaining rod. CONSTITUTION:A lead frame 3 fed by a conveying mechanism is retained by a retaining lever 10, and liquid-like adhesive paste 2 is uniformly and accurately coated. After it is coated with the paste 2, when the predetermined frame 3 is coated with the paste 2, the already coated paste 2 is retained by a retaining rod 5. Thus, the wettability of the frame 3 with the paste 2 is improved. Accordingly, the reliability of the step of die bonding a semiconductor with the paste is improved to enhance the yield of assembling the element.
JP62186732A 1987-07-28 1987-07-28 Manufacturing equipment for semiconductor Pending JPS6431424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62186732A JPS6431424A (en) 1987-07-28 1987-07-28 Manufacturing equipment for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62186732A JPS6431424A (en) 1987-07-28 1987-07-28 Manufacturing equipment for semiconductor

Publications (1)

Publication Number Publication Date
JPS6431424A true JPS6431424A (en) 1989-02-01

Family

ID=16193673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62186732A Pending JPS6431424A (en) 1987-07-28 1987-07-28 Manufacturing equipment for semiconductor

Country Status (1)

Country Link
JP (1) JPS6431424A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998017654A1 (en) * 1996-10-24 1998-04-30 Zeria Pharmaceutical Co., Ltd. Substituted benzoylaminothiazole derivatives and drugs containing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998017654A1 (en) * 1996-10-24 1998-04-30 Zeria Pharmaceutical Co., Ltd. Substituted benzoylaminothiazole derivatives and drugs containing the same

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