JPS6431427A - Resin sealing apparatus for semiconductor device - Google Patents

Resin sealing apparatus for semiconductor device

Info

Publication number
JPS6431427A
JPS6431427A JP18731987A JP18731987A JPS6431427A JP S6431427 A JPS6431427 A JP S6431427A JP 18731987 A JP18731987 A JP 18731987A JP 18731987 A JP18731987 A JP 18731987A JP S6431427 A JPS6431427 A JP S6431427A
Authority
JP
Japan
Prior art keywords
base
plate
block
clamping
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18731987A
Other languages
Japanese (ja)
Inventor
Koji Tsutsumi
Yutaka Morita
Hideaki Suezaki
Hiromichi Yamada
Suekichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18731987A priority Critical patent/JPS6431427A/en
Priority to US07/219,483 priority patent/US4915608A/en
Publication of JPS6431427A publication Critical patent/JPS6431427A/en
Priority to US07/447,866 priority patent/US4983111A/en
Priority to US07/447,917 priority patent/US5059379A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a resin burr from generating at a lead frame on a cavity block by securing spacer blocks at an interval from a surface plate on a base, and constituting a supporting pin of a base extending axially and collars formed at both ends of the base. CONSTITUTION:A spacer block 24 is secured at an interval from a surface plate 1 on a base 3, and a supporting pin 21 is constituted of a base 22 extending axially and collars 23 abutting against the plate 1 and the base 3. Thus, a thermal resistance between the plate 1 and the base 3 is increased to largely suppress the heat transfer from a heater 2 to a press, thereby eliminating a heat insulator in the base 3. Accordingly, the parting faces 5a of upper and lower cavity blocks 5 can be contacted each other at the time of clamping, pressing forces are uniformly acted on both the parting faces 5a. Only the pins 21 are axially and elastically contracted and deformed at the time of clamping the molds, thereby effectively preventing a resin burr from generating at the lead frame on the block.
JP18731987A 1987-07-20 1987-07-27 Resin sealing apparatus for semiconductor device Pending JPS6431427A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18731987A JPS6431427A (en) 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device
US07/219,483 US4915608A (en) 1987-07-20 1988-07-15 Device for resin sealing semiconductor devices
US07/447,866 US4983111A (en) 1987-07-20 1989-12-08 Device for resin sealing semiconductor devices
US07/447,917 US5059379A (en) 1987-07-20 1989-12-08 Method of resin sealing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18731987A JPS6431427A (en) 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6431427A true JPS6431427A (en) 1989-02-01

Family

ID=16203926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18731987A Pending JPS6431427A (en) 1987-07-20 1987-07-27 Resin sealing apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6431427A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266259A (en) * 1991-09-17 1993-11-30 Ford Motor Company Molding a reinforced plastics component
KR100713727B1 (en) * 1999-06-30 2007-05-03 텍사스 인스트루먼츠 인코포레이티드 Deformation-absorbing leadframe for semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266259A (en) * 1991-09-17 1993-11-30 Ford Motor Company Molding a reinforced plastics component
KR100713727B1 (en) * 1999-06-30 2007-05-03 텍사스 인스트루먼츠 인코포레이티드 Deformation-absorbing leadframe for semiconductor devices

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