JPS6431473A - 2-color light emitting element - Google Patents

2-color light emitting element

Info

Publication number
JPS6431473A
JPS6431473A JP18836087A JP18836087A JPS6431473A JP S6431473 A JPS6431473 A JP S6431473A JP 18836087 A JP18836087 A JP 18836087A JP 18836087 A JP18836087 A JP 18836087A JP S6431473 A JPS6431473 A JP S6431473A
Authority
JP
Japan
Prior art keywords
chips
light emitting
electrodes
lead frame
different
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18836087A
Other languages
Japanese (ja)
Inventor
Yoshinori Katsura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP18836087A priority Critical patent/JPS6431473A/en
Publication of JPS6431473A publication Critical patent/JPS6431473A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To remarkably increase the practical range of light emission by electrically connecting the electrode of the side different from that connected to a common lead terminal of two light emitting diode chips having different emitting colors to individual two lead frames, and connecting the different electrodes of the two chips of the same emitting color by a conductive wiring. CONSTITUTION:First red and green light emitting diode chips 1a, 2a, are bonded to a lead frame with conductive adhesive like silver paste to electrically connect their N-electrodes, i.e., cathodes with the common lead terminal 4a of the lead frame 4. Second diode chips 1b, 2b identical with the chips 1a, 2a are similarly bonded to electrically connect their P-electrodes, i.e., anodes with their corresponding leads 4b, 4c. These chips are paired with ones for the same color, and the individual pairs (1a, 1b) and (2a, 2b) are interconnected by conductors 5 at their ends opposite to the lead frame.
JP18836087A 1987-07-27 1987-07-27 2-color light emitting element Pending JPS6431473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18836087A JPS6431473A (en) 1987-07-27 1987-07-27 2-color light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18836087A JPS6431473A (en) 1987-07-27 1987-07-27 2-color light emitting element

Publications (1)

Publication Number Publication Date
JPS6431473A true JPS6431473A (en) 1989-02-01

Family

ID=16222259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18836087A Pending JPS6431473A (en) 1987-07-27 1987-07-27 2-color light emitting element

Country Status (1)

Country Link
JP (1) JPS6431473A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0482279A (en) * 1990-07-24 1992-03-16 Toshiba Corp Semiconductor device
JPH0492659U (en) * 1990-12-27 1992-08-12
JPH0537026A (en) * 1991-07-30 1993-02-12 Toshiba Corp LED lamp and LED display and LED display panel using the same
US5324962A (en) * 1991-06-13 1994-06-28 Kabushiki Kaisha Toshiba Multi-color semiconductor light emitting device
JP2010009404A (en) * 2008-06-27 2010-01-14 Fuji Electric Retail Systems Co Ltd Newspaper storage rack for newspaper vending machine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0482279A (en) * 1990-07-24 1992-03-16 Toshiba Corp Semiconductor device
JPH0492659U (en) * 1990-12-27 1992-08-12
US5324962A (en) * 1991-06-13 1994-06-28 Kabushiki Kaisha Toshiba Multi-color semiconductor light emitting device
US5491349A (en) * 1991-06-13 1996-02-13 Kabushiki Kaisha Toshiba Multi-color light emitting device
JPH0537026A (en) * 1991-07-30 1993-02-12 Toshiba Corp LED lamp and LED display and LED display panel using the same
JP2010009404A (en) * 2008-06-27 2010-01-14 Fuji Electric Retail Systems Co Ltd Newspaper storage rack for newspaper vending machine

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