JPS6431970A - Vacuum treatment equipment - Google Patents

Vacuum treatment equipment

Info

Publication number
JPS6431970A
JPS6431970A JP18802987A JP18802987A JPS6431970A JP S6431970 A JPS6431970 A JP S6431970A JP 18802987 A JP18802987 A JP 18802987A JP 18802987 A JP18802987 A JP 18802987A JP S6431970 A JPS6431970 A JP S6431970A
Authority
JP
Japan
Prior art keywords
chambers
vacuum treatment
gate valves
conveyed
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18802987A
Other languages
Japanese (ja)
Other versions
JPH0159354B2 (en
Inventor
Hidetaka Jo
Osamu Watanabe
Katsuya Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Tokuda Seisakusho Co Ltd
Original Assignee
Toshiba Corp
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokuda Seisakusho Co Ltd filed Critical Toshiba Corp
Priority to JP18802987A priority Critical patent/JPS6431970A/en
Publication of JPS6431970A publication Critical patent/JPS6431970A/en
Publication of JPH0159354B2 publication Critical patent/JPH0159354B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To shorten exhaust time and to improve vacuum treatment efficiency by providing, respectively in parallel, plural loading chambers and plural unloading chambers via gate valves free of opening and shutting to the former-stage side and the latter-stage side of a vacuum treatment chamber, respectively. CONSTITUTION:Plural loading chambers 5a-5c and plural unloading chambers 6a-6c are provided to the former-stage side and the latter-stage side of a vacuum treatment chamber 1, respectively, and gate valves 7 free of opening and shutting are provided to the respective chambers, by which evacuation from atmospheric pressure down to vacuum is made possible. In the above vacuum treatment equipment, materials 3 to be treated conveyed from a takein part 10 into a conveyance chamber 8 are positioned by means of conveyance belts 15 and stoppers 17 and moved up and down by means of supporting pins 16, respectively. Subsequently, the gate valves 7 are opened and the above materials 3 to be treated are conveyed by means of conveyance devices 14 into the loading chambers 5a-5c, and the insides of these chambers are evacuated, respectively. Then, the materials 3 to be treated are conveyed via gate valves 7 into the vacuum treatment chamber 1 to undergo the prescribed treatment. The materials 3 to be treated after the treatment are conveyed via gate valves 7 through the unloading chambers 6a-6c into a conveyance chamber 9 and then conveyed out from a takeout part 11.
JP18802987A 1987-07-28 1987-07-28 Vacuum treatment equipment Granted JPS6431970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18802987A JPS6431970A (en) 1987-07-28 1987-07-28 Vacuum treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18802987A JPS6431970A (en) 1987-07-28 1987-07-28 Vacuum treatment equipment

Publications (2)

Publication Number Publication Date
JPS6431970A true JPS6431970A (en) 1989-02-02
JPH0159354B2 JPH0159354B2 (en) 1989-12-15

Family

ID=16216418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18802987A Granted JPS6431970A (en) 1987-07-28 1987-07-28 Vacuum treatment equipment

Country Status (1)

Country Link
JP (1) JPS6431970A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5950330A (en) * 1990-08-29 1999-09-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61113766A (en) * 1984-11-09 1986-05-31 Nissin Electric Co Ltd end station

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61113766A (en) * 1984-11-09 1986-05-31 Nissin Electric Co Ltd end station

Cited By (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634116B2 (en) 1990-08-09 2003-10-21 Hitachi, Ltd. Vacuum processing apparatus
US6330755B1 (en) 1990-08-29 2001-12-18 Hitachi, Ltd. Vacuum processing and operating method
US6460270B2 (en) 1990-08-29 2002-10-08 Hitachi, Ltd. Vacuum processing apparatus
US6055740A (en) * 1990-08-29 2000-05-02 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6070341A (en) * 1990-08-29 2000-06-06 Hitachi, Ltd. Vacuum processing and operating method with wafers, substrates and/or semiconductors
US6108929A (en) * 1990-08-29 2000-08-29 Hitachi, Ltd. Vacuum processing apparatus
US6112431A (en) * 1990-08-29 2000-09-05 Hitachi, Ltd. Vacuum processing and operating method
US6263588B1 (en) 1990-08-29 2001-07-24 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6301802B1 (en) 1990-08-29 2001-10-16 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6301801B1 (en) 1990-08-29 2001-10-16 Shigekazu Kato Vacuum processing apparatus and operating method therefor
US6314658B2 (en) 1990-08-29 2001-11-13 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US5950330A (en) * 1990-08-29 1999-09-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6330756B1 (en) 1990-08-29 2001-12-18 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6332280B2 (en) 1990-08-29 2001-12-25 Hitachi, Ltd. Vacuum processing apparatus
US6446353B2 (en) 1990-08-29 2002-09-10 Hitachi, Ltd. Vacuum processing apparatus
US6457253B2 (en) 1990-08-29 2002-10-01 Hitachi, Ltd. Vacuum processing apparatus
US6484415B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
US6463678B2 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Substrate changing-over mechanism in a vaccum tank
US6463676B1 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6467186B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Transferring device for a vacuum processing apparatus and operating method therefor
US6467187B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6470596B2 (en) 1990-08-29 2002-10-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6473989B2 (en) 1990-08-29 2002-11-05 Hitachi, Ltd. Conveying system for a vacuum processing apparatus
US6044576A (en) * 1990-08-29 2000-04-04 Hitachi, Ltd. Vacuum processing and operating method using a vacuum chamber
US6484414B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
US6968630B2 (en) 1990-08-29 2005-11-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6487793B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6487791B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus
US6490810B2 (en) 1990-08-29 2002-12-10 Hitachi, Ltd. Vacuum processing apparatus
US6499229B2 (en) 1990-08-29 2002-12-31 Hitachi, Ltd. Vacuum processing apparatus
US6505415B2 (en) 1990-08-29 2003-01-14 Hitachi, Ltd. Vacuum processing apparatus
US6588121B2 (en) 1990-08-29 2003-07-08 Hitachi, Ltd. Vacuum processing apparatus
US6625899B2 (en) 1990-08-29 2003-09-30 Hitachi, Ltd. Vacuum processing apparatus
US6012235A (en) * 1990-08-29 2000-01-11 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6655044B2 (en) 1990-08-29 2003-12-02 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6662465B2 (en) 1990-08-29 2003-12-16 Hitachi, Ltd. Vacuum processing apparatus
US6880264B2 (en) 1990-08-29 2005-04-19 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6886272B2 (en) 1990-08-29 2005-05-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6904699B2 (en) 1990-08-29 2005-06-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6487794B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Substrate changing-over mechanism in vacuum tank
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39775E1 (en) * 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39824E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39823E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
US7367135B2 (en) 1990-08-29 2008-05-06 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor

Also Published As

Publication number Publication date
JPH0159354B2 (en) 1989-12-15

Similar Documents

Publication Publication Date Title
TW354405B (en) Processing apparatus
US4293249A (en) Material handling system and method for manufacturing line
US4299518A (en) Manufacturing work station
EP0398365A3 (en) Multiple chamber staged-vacuum semiconductor wafer processing system
JPS56142629A (en) Vacuum device
KR960002534A (en) Pressure reducing and atmospheric pressure treatment device
ZA992606B (en) Apparatus for bringing containers into and/or out of a treatment room.
SE8600228D0 (en) WAY TO TRANSPORT ARTICLES THROUGH A MANUFACTURING AND / OR FINISHING PROCESS
JPS6431970A (en) Vacuum treatment equipment
JPS62535A (en) Continuous plasma treatment apparatus
JPS61112312A (en) Vacuum continuous treater
JPS6431971A (en) Vacuum treatment device
JPS564244A (en) Continuous vacuum treatment device for wafer
JP2566308B2 (en) Processor equipped with load lock device
JPS6473619A (en) Method and apparatus for low-pressure process
JPS60102744A (en) Vacuum treater
JPS60115227A (en) Plasma processing method and apparatus for the same
JPS6486846A (en) Soaking of washed rice and apparatus therefor
GB1077246A (en) Method and apparatus for sterilizing
JPS5763677A (en) Continuous vacuum treating device
JPH0230759A (en) Vacuum treatment equipment
JPS57209101A (en) Equipment for automatically conveying article into and out of hermetic storage chamber
JPS61113766A (en) end station
JPH0237742A (en) Semiconductor device manufacturing equipment
JPS61113767A (en) End station

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees