JPS6431991A - Manufacture of amorphous plating alloy - Google Patents

Manufacture of amorphous plating alloy

Info

Publication number
JPS6431991A
JPS6431991A JP18668487A JP18668487A JPS6431991A JP S6431991 A JPS6431991 A JP S6431991A JP 18668487 A JP18668487 A JP 18668487A JP 18668487 A JP18668487 A JP 18668487A JP S6431991 A JPS6431991 A JP S6431991A
Authority
JP
Japan
Prior art keywords
amorphous alloy
potential
plating bath
time
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18668487A
Other languages
Japanese (ja)
Inventor
Toru Takemura
Masaharu Oda
Kazumi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP18668487A priority Critical patent/JPS6431991A/en
Publication of JPS6431991A publication Critical patent/JPS6431991A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To form an amorphous alloy plating film free from deterioration in strength and toughness due to hydrogen embrittlement, by carrying out electroplating by using a plating bath containing respective ions of metals forming an amorphous alloy and also by allowing a pulse current of specific conditions to flow. CONSTITUTION:Plating is carried out in a plating bath containing mixed ions of metals, such as Ni, Cr, Fe, Au, Cu, Al, and Ti, by using, as an electrode, a metal insoluble in the plating bath, such as Pt, stainless steel, and Au, and also using a pulse current so as to prevent the amorphous alloy plating film to be formed from embrittling due to hydrogen, and simultaneously, a relationship between the pulse current J at this time and an electric current JH consumed at the time of hydrogen generation satisfies JH/J<0.1. At this time, an electric potential baser than the oxidation-reduction potential of the metal ions contained in the plating bath is impressed as a pulse potential and, as a bias potential, an electric potential nobler than the above oxidation-reduction potential is impressed, by which the amorphous alloy plating film free from hydrogen embrittlement and excellent in mechanical strength can be stably obtained.
JP18668487A 1987-07-28 1987-07-28 Manufacture of amorphous plating alloy Pending JPS6431991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18668487A JPS6431991A (en) 1987-07-28 1987-07-28 Manufacture of amorphous plating alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18668487A JPS6431991A (en) 1987-07-28 1987-07-28 Manufacture of amorphous plating alloy

Publications (1)

Publication Number Publication Date
JPS6431991A true JPS6431991A (en) 1989-02-02

Family

ID=16192830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18668487A Pending JPS6431991A (en) 1987-07-28 1987-07-28 Manufacture of amorphous plating alloy

Country Status (1)

Country Link
JP (1) JPS6431991A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008542552A (en) * 2005-06-07 2008-11-27 マサチューセッツ インスティテュート オブ テクノロジー Production of alloy deposits using electrodeposition with negative current pulse and control of the nanostructures, and articles incorporating such deposits
JP2024086356A (en) * 2022-12-16 2024-06-27 株式会社日立製作所 Gel plating system and gel plating method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008542552A (en) * 2005-06-07 2008-11-27 マサチューセッツ インスティテュート オブ テクノロジー Production of alloy deposits using electrodeposition with negative current pulse and control of the nanostructures, and articles incorporating such deposits
KR101283883B1 (en) * 2005-06-07 2013-07-08 메사추세츠 인스티튜트 오브 테크놀로지 Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition, and articles incorporating such deposits
US8728630B2 (en) 2005-06-07 2014-05-20 Massachusetts Institute Of Technology Articles incorporating alloy deposits having controlled, varying nanostructure
US8906216B2 (en) 2005-06-07 2014-12-09 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using electro-deposition with controlled polarity ratio
JP2024086356A (en) * 2022-12-16 2024-06-27 株式会社日立製作所 Gel plating system and gel plating method

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