JPS643291U - - Google Patents
Info
- Publication number
- JPS643291U JPS643291U JP9342687U JP9342687U JPS643291U JP S643291 U JPS643291 U JP S643291U JP 9342687 U JP9342687 U JP 9342687U JP 9342687 U JP9342687 U JP 9342687U JP S643291 U JPS643291 U JP S643291U
- Authority
- JP
- Japan
- Prior art keywords
- speaker
- fixing
- fixing structure
- fitting
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Description
第1図は本考案の実施例を示す図、第2図は従
来のワイヤレス電話機を示す図、第3図は従来の
ハンドセツトユニツトのスピーカ取付構造を示す
図である。
第1図において、10はスピーカ、11は筐体
、12はスピーカ取付枠、13は凹部、14は固
定部、15はねじ、16は固定金具、17は端子
、18はコード接続用基板、19は配線パターン
である。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing a conventional wireless telephone, and FIG. 3 is a diagram showing a conventional speaker mounting structure of a handset unit. In FIG. 1, 10 is a speaker, 11 is a housing, 12 is a speaker mounting frame, 13 is a recess, 14 is a fixing part, 15 is a screw, 16 is a fixing metal fitting, 17 is a terminal, 18 is a cord connection board, 19 is the wiring pattern.
Claims (1)
13に挿入し、その上部を押圧するように固定金
具16で固定するスピーカ固定構造において、 予めスピーカ端子17にコード接続用基板18
を半田付けしておき、該基板18を前記固定金具
16に当接したことを特徴としたスピーカ固定構
造。[Scope of Claim for Utility Model Registration] In a speaker fixing structure in which a disc-shaped speaker 10 is inserted into a recess 13 provided in a housing 11 and is fixed with a fixing fitting 16 so as to press the upper part thereof, Cord connection board 18
A speaker fixing structure characterized in that the substrate 18 is abutted against the fixing fitting 16 by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9342687U JPS643291U (en) | 1987-06-19 | 1987-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9342687U JPS643291U (en) | 1987-06-19 | 1987-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS643291U true JPS643291U (en) | 1989-01-10 |
Family
ID=31317884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9342687U Pending JPS643291U (en) | 1987-06-19 | 1987-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS643291U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6043056B2 (en) * | 1980-05-27 | 1985-09-26 | 株式会社日本触媒 | Method for purifying 2-hydroxyalkyl acrylate or 2-hydroxyalkyl methacrylate |
-
1987
- 1987-06-19 JP JP9342687U patent/JPS643291U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6043056B2 (en) * | 1980-05-27 | 1985-09-26 | 株式会社日本触媒 | Method for purifying 2-hydroxyalkyl acrylate or 2-hydroxyalkyl methacrylate |
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