JPS6433084A - Partial modification method for oxide ceramic surface - Google Patents

Partial modification method for oxide ceramic surface

Info

Publication number
JPS6433084A
JPS6433084A JP62187778A JP18777887A JPS6433084A JP S6433084 A JPS6433084 A JP S6433084A JP 62187778 A JP62187778 A JP 62187778A JP 18777887 A JP18777887 A JP 18777887A JP S6433084 A JPS6433084 A JP S6433084A
Authority
JP
Japan
Prior art keywords
nitriding
atmosphere
sintered body
thermal energy
powders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62187778A
Other languages
Japanese (ja)
Inventor
Haruo Taguchi
Eisaku Miyauchi
Shoichi Iwatani
Shigehiro Funaki
Hitoshi Masumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP62187778A priority Critical patent/JPS6433084A/en
Publication of JPS6433084A publication Critical patent/JPS6433084A/en
Pending legal-status Critical Current

Links

Landscapes

  • Resistance Heating (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

PURPOSE:To easily perform a modification due to a nitriding or reduction of a desired specific area of said oxide ceramic surface by projecting a thermal energy onto a part of the ceramic in an irradiation region kept in a nitriding atmosphere or reducing atmosphere. CONSTITUTION:Granulated powders are prepared by incorporating a suitable amount of PVA with respective powders of TiO2, Al2O3, BaTiO3, etc., and the powders are molded under pressure, being calculated in air. The obtained base plate of a sintered body consisting of TiO2, Al2O3, BaTiO3, etc., is partially irradiated with a thermal energy of a laser in a nitriding atmosphere or reducing atmosphere of N2, H2, NH3, etc. Thus, the surface area of the above-mentioned sintered body can be partially modified only be projecting partially the thermal energy ray without forming a film on a surface of the sintered body. Further, respective characteristics of reduction, metallization, nitriding, etc., are easily materialized by controlling an ambient atmosphere.
JP62187778A 1987-07-29 1987-07-29 Partial modification method for oxide ceramic surface Pending JPS6433084A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62187778A JPS6433084A (en) 1987-07-29 1987-07-29 Partial modification method for oxide ceramic surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62187778A JPS6433084A (en) 1987-07-29 1987-07-29 Partial modification method for oxide ceramic surface

Publications (1)

Publication Number Publication Date
JPS6433084A true JPS6433084A (en) 1989-02-02

Family

ID=16212054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62187778A Pending JPS6433084A (en) 1987-07-29 1987-07-29 Partial modification method for oxide ceramic surface

Country Status (1)

Country Link
JP (1) JPS6433084A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02312202A (en) * 1989-05-26 1990-12-27 Sangyo Souzou Kenkyusho Manufacture of barium titanate semiconductor
JPH03257086A (en) * 1990-03-02 1991-11-15 Inax Corp Surface treatment of fired body
JPH03257084A (en) * 1990-03-02 1991-11-15 Inax Corp Reduction treatment of fired body
JPH03257085A (en) * 1990-03-02 1991-11-15 Inax Corp Reduction treatment of fired body
JPH0831694A (en) * 1994-07-14 1996-02-02 Tdk Corp Electronic part and manufacture of it
JPH08175888A (en) * 1994-12-21 1996-07-09 Alps Electric Co Ltd Metallized ceramic and its production
JP2001097786A (en) * 1999-07-29 2001-04-10 Kyocera Corp Ceramic member marking method and marked ceramic member
JP2006228633A (en) * 2005-02-18 2006-08-31 Ngk Insulators Ltd Manufacturing method of substrate heater, and the substrate heater
JP2008288196A (en) * 2007-04-16 2008-11-27 Kao Corp Method for producing transparent conductive film
JP2014065649A (en) * 2012-09-27 2014-04-17 Seiren Co Ltd Ceramic surface modification method
WO2014087945A1 (en) * 2012-12-07 2014-06-12 富士フイルム株式会社 Process for manufactuing conductive film and printed wiring board
JP2018085437A (en) * 2016-11-24 2018-05-31 株式会社村田製作所 Method for manufacturing electronic component and electronic component
JP2018093010A (en) * 2016-12-01 2018-06-14 株式会社村田製作所 Wound wire type coil component and manufacturing method of wire wound coil component
JP2018098372A (en) * 2016-12-14 2018-06-21 株式会社村田製作所 Ceramic electronic component and manufacturing method thereof
WO2018220901A1 (en) * 2017-05-31 2018-12-06 株式会社村田製作所 Method for manufacturing ceramic electronic component, and ceramic electronic component
JP2020047929A (en) * 2019-11-27 2020-03-26 株式会社村田製作所 Wound coil component and manufacturing method thereof

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02312202A (en) * 1989-05-26 1990-12-27 Sangyo Souzou Kenkyusho Manufacture of barium titanate semiconductor
JPH03257086A (en) * 1990-03-02 1991-11-15 Inax Corp Surface treatment of fired body
JPH03257084A (en) * 1990-03-02 1991-11-15 Inax Corp Reduction treatment of fired body
JPH03257085A (en) * 1990-03-02 1991-11-15 Inax Corp Reduction treatment of fired body
JPH0831694A (en) * 1994-07-14 1996-02-02 Tdk Corp Electronic part and manufacture of it
JPH08175888A (en) * 1994-12-21 1996-07-09 Alps Electric Co Ltd Metallized ceramic and its production
JP2001097786A (en) * 1999-07-29 2001-04-10 Kyocera Corp Ceramic member marking method and marked ceramic member
JP2006228633A (en) * 2005-02-18 2006-08-31 Ngk Insulators Ltd Manufacturing method of substrate heater, and the substrate heater
JP2008288196A (en) * 2007-04-16 2008-11-27 Kao Corp Method for producing transparent conductive film
JP2014065649A (en) * 2012-09-27 2014-04-17 Seiren Co Ltd Ceramic surface modification method
WO2014087945A1 (en) * 2012-12-07 2014-06-12 富士フイルム株式会社 Process for manufactuing conductive film and printed wiring board
JP2018085437A (en) * 2016-11-24 2018-05-31 株式会社村田製作所 Method for manufacturing electronic component and electronic component
JP2018093010A (en) * 2016-12-01 2018-06-14 株式会社村田製作所 Wound wire type coil component and manufacturing method of wire wound coil component
US10998117B2 (en) 2016-12-01 2021-05-04 Murata Manufacturing Co., Ltd. Wire-wound coil component and method for producing wire-wound coil component
JP2018098372A (en) * 2016-12-14 2018-06-21 株式会社村田製作所 Ceramic electronic component and manufacturing method thereof
WO2018220901A1 (en) * 2017-05-31 2018-12-06 株式会社村田製作所 Method for manufacturing ceramic electronic component, and ceramic electronic component
CN110268489A (en) * 2017-05-31 2019-09-20 株式会社村田制作所 Manufacturing method of ceramic electronic component and ceramic electronic component
JPWO2018220901A1 (en) * 2017-05-31 2019-11-07 株式会社村田製作所 Method for manufacturing ceramic electronic component and ceramic electronic component
US10971305B2 (en) 2017-05-31 2021-04-06 Murata Manufacturing Co., Ltd. Method for manufacturing ceramic electronic component and ceramic electronic component
CN110268489B (en) * 2017-05-31 2021-07-20 株式会社村田制作所 Manufacturing method of ceramic electronic component and ceramic electronic component
JP2020047929A (en) * 2019-11-27 2020-03-26 株式会社村田製作所 Wound coil component and manufacturing method thereof

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