JPS6433367U - - Google Patents

Info

Publication number
JPS6433367U
JPS6433367U JP12877187U JP12877187U JPS6433367U JP S6433367 U JPS6433367 U JP S6433367U JP 12877187 U JP12877187 U JP 12877187U JP 12877187 U JP12877187 U JP 12877187U JP S6433367 U JPS6433367 U JP S6433367U
Authority
JP
Japan
Prior art keywords
solder
jet
duct
jet port
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12877187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12877187U priority Critical patent/JPS6433367U/ja
Publication of JPS6433367U publication Critical patent/JPS6433367U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案の一実施例を説明す
るための図、第３図は従来装置を説明するための
図である。 １……半田槽本体、２……半田、３……半田噴
流用ダクト、４……フアン、５……モータ、６…
…ベルト、７……プーリ、８……半田吸込口、９
……噴流口、１０……枠、１１……半田流出口、
１２……半田酸化防止用板。 1 and 2 are diagrams for explaining an embodiment of the present invention, and FIG. 3 is a diagram for explaining a conventional device. 1...Solder tank body, 2...Solder, 3...Solder jet duct, 4...Fan, 5...Motor, 6...
...Belt, 7...Pulley, 8...Solder suction port, 9
...jet port, 10...frame, 11...solder outlet,
12...Plate for preventing solder oxidation.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半田噴流用ダクトの形成された装置本体内に溶
融された半田が収納されてなる半田槽装置におい
て、上記半田噴流用ダクトの噴流口の外側に該噴
流口より流れ出た半田が流れ込むような枠を配設
したことを特徴とする半田槽装置。 In a solder tank device in which molten solder is stored in a device body in which a duct for solder jet is formed, a frame is provided outside the jet port of the duct for solder jet into which the solder flowing out from the jet port flows. A solder bath device characterized by the following:
JP12877187U 1987-08-25 1987-08-25 Pending JPS6433367U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12877187U JPS6433367U (en) 1987-08-25 1987-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12877187U JPS6433367U (en) 1987-08-25 1987-08-25

Publications (1)

Publication Number Publication Date
JPS6433367U true JPS6433367U (en) 1989-03-01

Family

ID=31382421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12877187U Pending JPS6433367U (en) 1987-08-25 1987-08-25

Country Status (1)

Country Link
JP (1) JPS6433367U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010269341A (en) * 2009-05-21 2010-12-02 Mitsubishi Electric Corp Soldering nozzle and soldering device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61286058A (en) * 1985-06-11 1986-12-16 Meisho Kk Jet type solder tank
JPS6213731U (en) * 1985-07-11 1987-01-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61286058A (en) * 1985-06-11 1986-12-16 Meisho Kk Jet type solder tank
JPS6213731U (en) * 1985-07-11 1987-01-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010269341A (en) * 2009-05-21 2010-12-02 Mitsubishi Electric Corp Soldering nozzle and soldering device

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