JPS64334U - - Google Patents
Info
- Publication number
- JPS64334U JPS64334U JP9391387U JP9391387U JPS64334U JP S64334 U JPS64334 U JP S64334U JP 9391387 U JP9391387 U JP 9391387U JP 9391387 U JP9391387 U JP 9391387U JP S64334 U JPS64334 U JP S64334U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- insulating material
- metal
- metal electrode
- chippukiyariya
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
Description
第１図イ，ロは本考案の一実施例によるチツプ
キヤリアを示す正面図と裏面図、第２図イ，ロは
本考案の一実施例によるチツプキヤリアの作製前
の状態を順を追つて示した正面図、第３図イ，ロ
は従来のチツプキヤリアを示す正面図と平面図で
ある。
６……アルミニウム金属ベース（金属ベース）
、７……絶縁性材料のフイルム（絶縁性材料）、
８……銅箔、９……電極パターン、１０……電極
端子（金属電極）。
Figures 1A and 2B show front and back views of a chip carrier according to an embodiment of the present invention, and Figures 2A and 2B show the chip carrier according to an embodiment of the present invention in a step-by-step state before fabrication. The front view and FIGS. 3A and 3B are a front view and a plan view showing a conventional chip carrier. 6...Aluminum metal base (metal base)
, 7... film of insulating material (insulating material),
8... Copper foil, 9... Electrode pattern, 10... Electrode terminal (metal electrode).
Claims (1)
た絶縁性材料と、前記絶縁性材料表面に所望の形
状に形成された金属電極とからなり、前記金属電
極の一部を含むように前記金属ベースを折り曲げ
たことを特徴とするチツプキヤリア。 It consists of a metal base, an insulating material provided on the surface of the metal base, and a metal electrode formed in a desired shape on the surface of the insulating material, and the metal base is arranged so as to include a part of the metal electrode. Chippukiyariya is characterized by its folded shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9391387U JPS64334U (en) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9391387U JPS64334U (en) | 1987-06-18 | 1987-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS64334U true JPS64334U (en) | 1989-01-05 |
Family
ID=30956903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9391387U Pending JPS64334U (en) | 1987-06-18 | 1987-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64334U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153828A (en) * | 1994-09-27 | 1996-06-11 | Nec Corp | Package for semiconductor device |
| JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mount type package and semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059538B2 (en) * | 1980-09-26 | 1985-12-25 | 株式会社日立製作所 | Emission spectrometer |
-
1987
- 1987-06-18 JP JP9391387U patent/JPS64334U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059538B2 (en) * | 1980-09-26 | 1985-12-25 | 株式会社日立製作所 | Emission spectrometer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153828A (en) * | 1994-09-27 | 1996-06-11 | Nec Corp | Package for semiconductor device |
| JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mount type package and semiconductor device |